Datasheet

Package thermal data VNB14NV04, VND14NV04, VND14NV04-1, VNS14NV04
18/31 Doc ID 7393 Rev 9
4 Package thermal data
4.1 DPAK thermal data
Figure 33. DPAK PC board
(1)
1. Layout condition of R
th
and Z
th
measurements (PCB FR4 area = 60 mm x 60 mm, PCB thickness=2 mm,
Cu thickness=35 µm, Copper areas: from minimum pad lay-out to 8 cm
2
).
Figure 34. DPAK R
thj-amb
vs PCB copper area in open box free air condition