Datasheet

Package and PCB thermal data VN750PS-E
20/27 Doc ID 16782 Rev 3
3 Package and PCB thermal data
3.1 SO-8 thermal data
Figure 27. PC board
Figure 28. R
thj-amb
vs PCB copper area in open box free air condition
.
Note:
Layout condition of R
th
and Z
th
measurements (PCB FR4 area = 58 mm x 58 mm, PCB thickness = 2 mm, Cu
thickness=35 µm, Copper areas: 0.14 cm
2
, 0.8 cm
2
, 2 cm
2
).
70
75
80
85
90
95
100
105
110
00.511.522.5
PCB Cu heatsink area (cm^2)
RTHj_am b (ºC/W)
SO-8 at 2 pins connected to TAB