Datasheet

VN5E160AS-E Package and PCB thermal data
Doc ID 15609 Rev 4 29/37
4 Package and PCB thermal data
4.1 SO-8 thermal data
Figure 35. SO-8 PC board
(1)
1. Layout condition of R
th
and Z
th
measurements (PCB: FR4 area = 4.8 mm x 4.8 mm,
PCB thickness = 2 mm, Cu thickness = 35 µm, Copper areas: from minimum pad lay-out to 2 cm
2
).
Figure 36. R
thj-amb
vs PCB copper area in open box free air condition
("1($'5
60
70
80
90
100
110
0 0.5 1 1.5 2 2.5
RTHj_amb(°C/W)
PCB Cu heatsink area (cm^2)