Datasheet

Package and PC board thermal data VN5E010AH
28/37 Doc ID 15984 Rev 3
4 Package and PC board thermal data
4.1 HPAK thermal data
Figure 35. PC board
(1)
1. Layout condition of Rth and Zth measurements (PCB FR4 area = 58 mm x 58 mm,
PCB thickness =1.8 mm, Cu thickness = 70 µm, Copper areas: from minimum pad lay-out to 8 cm
2
).
Figure 36. R
thj-amb
vs. PCB copper area in open box free air condition
30
35
40
45
50
55
60
65
70
0246810
RTHj_amb(°C/W)
PCB Cu heatsink area (cm^2)