Datasheet

Package and PC board thermal data VN5772AK-E
26/34 Doc ID 16084 Rev 6
Figure 32. Auto and mutual Rthj-amb vs PCB copper area in open box free air
condition
(1)
1. See Figure 31. For more detailed information see Table 23 and Table 24.
Table 23. Thermal calculations in clockwise and anti-clockwise operation in steady-
state mode
HS
1
HS
2
LS
3
LS
4
T
jHS12
T
jLS3
T
jLS4
On Off Off On
P
dHS1
x R
thHS
+ P
dLS4
x
R
thHSLS
+ T
amb
P
dHS1
x R
thHSLS
+
P
dLS4
x R
thLSLS
+ T
amb
P
dHS1
x R
thHSLS
+
P
dLS4
x R
thLS
+ T
amb
Off On On Off
P
dHS2
x R
thHS
+ P
dLS3
x
R
thHSLS
+ T
amb
P
dHS2
x R
thHSLS
+
P
dLS3
x R
thLS
+ T
amb
P
dHS2
x R
thHSLS
+
P
dLS3
x R
thLSLS
+ T
amb
Table 24. Thermal resistances definitions
(1)
1. values dependent on PCB heatsink area.
R
thHS
= R
thHS1
= R
thHS2
High-side chip thermal resistance junction-to-ambient
(HS
1
or HS
2
in on-state)
R
thLS
= R
thLS3
= R
thLS4
Low-side chip thermal resistance junction-to-ambient
R
thHSLS
= R
thHS1LS4
= R
thHS2LS3
Mutual thermal resistance junction-to-ambient
between high-side and low-side chips
R
thLSLS
= R
thLS3LS4
Mutual thermal resistance junction-to-ambient
between low-side chips
Table 25. Single pulse thermal impedance definitions
(1)
1. values dependent on PCB heatsink area.
Z
thHS
High-side chip thermal impedance junction-to-ambient
Z
thLS
= Z
thLS3
= Z
thLS4
Low-side chip thermal impedance junction-to-ambient
Z
thHSLS
= Z
thHS12LS3
= Z
thHS12LS4
Mutual thermal impedance junction-to-ambient between
high-side and low-side chips
Z
thLSLS
= Z
thLS3LS4
Mutual thermal impedance junction-to-ambient between low-
side chips
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