Datasheet

VN5772AK-E Package and PC board thermal data
Doc ID 16084 Rev 6 25/34
4 Package and PC board thermal data
4.1 SO-28 thermal data
Figure 30. SO-28 PC board
(1)
1. Layout condition of Rth and Zth measurements (Board finish thickness 1.6 mm +/- 10%; Board double
layers; Board dimension 77x86; Board Material FR4; Cu thickness 0.070mm (front and back side); Thermal
vias separation 1.2 mm; Thermal via diameter 0.3 mm +/- 0.08 mm; Cu thickness on vias 0.025 mm).
Figure 31. Chipset configuration
("1($'5
HIGH-SIDE
CHIP
channels 1,2
LOW-SIDE
CHIP
LOW-SIDE
CHIP
channel 3
channel 4
R
thB
R
thA
R
thC
R
thAB
R
thAC
R
thBC