Datasheet

Package and PCB thermal data VN5050J-E
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4 Package and PCB thermal data
4.1 PowerSSO-12™ thermal data
Figure 30. PowerSSO-12™ PC Board
Note: Layout condition of R
th
and Z
th
measurements (PCB: Double layer, Thermal Vias, FR4
area= 77mm x 86mm,PCB thickness=1.6mm, Cu thickness=70 µm (front and back side),
Copper areas: from minimum pad lay-out to 8cm
2
).
Figure 31. R
thj-amb
Vs. PCB copper area in open box free air condition
35
40
45
50
55
60
65
0246810
RTHj_amb(°C/ W)
PCB Cu heatsink area (cm^ 2)