Datasheet

USBULC6-2M6 Recommendation on PCB assembly
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5 Recommendation on PCB assembly
5.1 Stencil opening design
1. General recommendation on stencil opening design
a) Stencil opening dimensions: L (Length), W (Width), T (Thickness)
Figure 16. Stencil opening dimensions.
b) General Design Rule
Stencil thickness (T) = 75 ~ 125 µm
2. Reference design
a) Stencil opening thickness: 100 µm
b) Stencil opening for leads: Opening to footprint ratio is 90%.
5.2 Solder paste
1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste is recommended.
3. Offers a high tack force to resist component movement during high speed
4. Solder paste with fine particles: powder particle size is 20-45 µm.
L
T
W
Aspect Ratio
W
T
-----
1.5≥=
Aspect Area
LW×
2T L W+()
----------------------------
0.66≥=