Datasheet

Package information USBULC6-2F3
6/9 DocID12970 Rev 4
4 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
Figure 16. Package dimensions
Figure 17. Footprint recommendations Figure 18. Marking
0.82 mm ± 30 µm
0.82 mm ± 30µm
400 µm ± 40
255 µm ± 40
400 µm ± 40
605 µm ± 55
210 µm
210 µm
220 µm recommended
220 µm recommended
260 µm maximum
Solder stencil opening :
Copper pad Diameter:
Solder mask opening:
300 µm minimum
x
y
x
w
z
w
Dot
xx = marking
yww = datecode
(y = year
ww = week)
z = manufacturing location