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This is information on a product in full production.

April 2014 DocID12970 Rev 4 1/9

USBULC6-2F3

2-line Transil™, transient surge voltage suppressor (TVS)

ultralow capacitance protection for high speed USB

Datasheet

production data

Figure 1. Pin layout (bump side) and Device

configuration

Features

• Ultralow diode capacitance (1.5 pF max)

• Two data lines (D+ and D-) protected against

ESD

• Breakdown voltage V

= 6.0 V min.

• Flip Chip, 400 µm pitch, lead-free

• Very low leakage current

• Very small PCB area

• RoHS compliant

Benefits

• Minimized impact on rise and fall times for

maximum data integrity

• Low PCB space occupation

• Higher reliability offered by monolithic

integration

Complies with the following standards

• IEC 61000-4-2 level 4 on external pins:

– 8 kV (contact discharge)

• MIL STD 883G - Method 3015.7

– 25 kV (Human body model)

Application

This device is designed to protect a high speed

USB port in wireless handsets (up to 480 Mb/s

according to USB 2.0 high speed specification).

Description

The USBULC6-2F3 is a monolithic, application

specific discrete device dedicated to ESD

protection of high speed interfaces.

Its ultralow line capacitance secures a high level

of signal integrity without compromising the

protection of downstream sensitive chips against

the most stringently characterized ESD strikes.

TM: Transil is a trademark of STMicroelectronics.

Flip Chip

USBULC6-2F3

(4 bumps)

Note: B1 and B2 bumps must be grounded on

the PCB together

www.st.com

Summary of content (9 pages)

PAGE 1
USBULC6-2F3 2-line Transil™, transient surge voltage suppressor (TVS) ultralow capacitance protection for high speed USB Datasheet - production data • Breakdown voltage VBR = 6.0 V min. • Flip Chip, 400 µm pitch, lead-free • Very low leakage current • Very small PCB area • RoHS compliant Flip Chip USBULC6-2F3 (4 bumps) Benefits • Minimized impact on rise and fall times for maximum data integrity • Low PCB space occupation Figure 1.
PAGE 2
Characteristics 1 USBULC6-2F3 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value Unit VPP ESD discharge IEC 61000-4-2: Contact discharge 10 PPP Peak pulse power dissipation (8/20 µs) 90 W Maximum junction temperature 125 °C Tj kV Top Operating temperature range -30 to + 85 °C Tstg Storage temperature range -55 to +150 °C Figure 2.
PAGE 3
USBULC6-2F3 Characteristics Figure 3. Eye diagram, board only (according to USB high speed specification) Figure 4. Eye diagram, board with USBULC6-2F3 (according to USB 2.0 high speed specification) Horiz: 347 ps/div Ver: 200 mV/div Horiz: 347 ps/div Ver: 200 mV/div Figure 5. ESD response to IEC 61000-4-2 (+8 kV contact discharge)(1) Figure 6. ESD response to IEC 61000-4-2 (-8 kV contact discharge)(1) 10 V/div 20 V/div 113.8 V 1 2 3 4 1 21.
PAGE 4
Characteristics USBULC6-2F3 Figure 9. S21 (dB) attenuation measurement 0 S21 dB -2 -4 -6 -8 F (Hz) -10 100k 1M 10M 100M 1G 10G Figure 10. Peak pulse power versus initial Figure 11. Peak pulse power versus exponential junction temperature (maximum values, pulse pulse duration (maximum values) 8/20 µs) 140 Ppp (W) Ppp (W) 1000 Tj = 25° C 120 100 A1 and A2 / GND, 8/20 µs 100 A1 and A2 / GND 80 60 10 40 20 Tj(°C) tP(µs) 0 1 0 25 50 75 100 125 150 Figure 12.
PAGE 5
USBULC6-2F3 2 Application information Application information Figure 14. Application diagram USB CONNECTOR Vbus Vbus DB2 A2 B1 A1 D- D+ D+ GND GND TO USB TRANSCEIVER 3 Ordering information scheme Figure 15.
PAGE 6
Package information 4 USBULC6-2F3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 210 µm 0.82 mm ± 30 µm 0.82 mm ± 30µm 255 µm ± 40 Figure 17. Footprint recommendations Figure 18.
PAGE 7
USBULC6-2F3 Ordering information Dot identifying Pin A1 location Ø 1.55 ± 0.1 4.0 ± 0.1 2.0 ± 0.05 3.5 ±- 0.05 0.90 ± 0.03 xxz yww xxz yww xxz yww 8.0 ± 0.3 0.20 ± 0.02 1.75 ± 0.1 Figure 19. Tape and reel specifications 0.90 ± 0.03 4.0 ± 0.05 0.69 ± 0.
PAGE 8
Revision history 6 USBULC6-2F3 Revision history Table 4. Document revision history Date Revision 15-Dec-2006 1 Initial release. 29-Apr-2008 2 Updated ECOPACK statement. Updated Figure 16, Figure 17 and Figure 19. Reformatted to current standards. 27-Jun-2011 3 Added Figure 5 and Figure 6. Updated die dimensions in Figure 16 and pocket dimensions in Figure 19. 4 Updated bump-side Pin 1 dot in Figure and Figure 16. Updated value of Cline inTable 2.
PAGE 9
USBULC6-2F3 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale.