Datasheet

Ordering information USB6B1
8/9
Figure 10. SO-8 footprint (dimensions in mm)
In order to meet environmental requirements, ST offers these devices in ECOPACKĀ®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
6 Ordering information
7 Revision history
6.8
4.2
1.27
0.6
Ordering code Marking Package Weight Base qty Delivery mode
USB6B1 USB62
SO-8 0.077 g
100 Tube
USB6B1RL USB62 2500 Tape and reel
Date Revision Description of Changes
Oct-2003 6A Previous issue.
03-May-2005 7 Figure 1 on page 1: dots connection corrected.
22-Feb-2006 8 Marking typing error corrected on page 1 and 7.
16-Aug-2006 9
Reformated to current standard. ECOPACK statement
added. SO-8 package dimensions corrected.