TSX561, TSX562, TSX564, TSX561A, TSX562A, TSX564A Micropower, wide bandwidth (900 kHz), 16 V CMOS operational amplifiers Datasheet - production data Benefits • Power savings in power-conscious applications 627 VLQJOH • Easy interfacing with high impedance sensors ')1 [ GXDO Related products • See TSX63x series for reduced power consumption (45 μA, 200 kHz) • See TSX92x series for higher gain bandwidth products (10 MHz) 0LQL62 GXDO 62 GXDO Applications • Industrial and automotive signal co
Contents TSX56x, TSX56xA Contents 1 Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Absolute maximum ratings and operating conditions . . . . . . . . . . . . . 4 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 5 4.1 Operating voltages . . . . . . . . . . . . . . . . . . . . . .
TSX56x, TSX56xA Pin connections Figure 1.
Absolute maximum ratings and operating conditions 2 TSX56x, TSX56xA Absolute maximum ratings and operating conditions Table 2. Absolute maximum ratings (AMR) Symbol VCC Vid Vin Iin Tstg Rthja Rthjc Tj Parameter Supply voltage (2) ±VCC V (3) VCC- - 0.2 to VCC++ 0.
TSX56x, TSX56xA 3 Electrical characteristics Electrical characteristics Table 4. Electrical characteristics at VCC+ = +3.3 V with VCC- = 0 V, Vicm = VCC/2, Tamb = 25 °C, and RL=10 kΩ connected to VCC/2 (unless otherwise specified) Symbol Parameter Conditions Min. Typ. Max. Unit DC performance Vio Offset voltage TSX56xA, T = 25 °C 600 TSX56xA, -40 °C < T < 125 °C 1800 TSX56x, T = 25 °C 1 TSX56x, -40 °C < T < 125 °C 2.
Electrical characteristics TSX56x, TSX56xA Table 4. Electrical characteristics at VCC+ = +3.3 V with VCC- = 0 V, Vicm = VCC/2, Tamb = 25 °C, and RL=10 kΩ connected to VCC/2 (unless otherwise specified) (continued) Symbol Parameter Conditions Min. Typ. 600 800 Max. Unit AC performance GBP Gain bandwidth product Fu Unity gain frequency Φm Phase margin Gm Gain margin SR Slew rate ∫ en en THD+N RL = 10 kΩ, CL = 100 pF kHz 55 Degree 9 dB RL = 10 kΩ, CL = 100 pF, Vout = 0.
TSX56x, TSX56xA Electrical characteristics Table 5. Electrical characteristics at VCC+ = +5 V with VCC- = 0 V, Vicm = VCC/2, Tamb = 25 °C, and RL = 10 kΩ connected to VCC/2 (unless otherwise specified) Symbol Parameter Conditions Min. Typ. Max. Unit DC performance Vio Offset voltage TSX56xA, T = 25 °C 600 TSX56xA, -40 °C < T < 125 °C 1800 TSX56x, T = 25 °C 1 TSX56x, -40 °C < T < 125 °C 2.
Electrical characteristics TSX56x, TSX56xA Table 5. Electrical characteristics at VCC+ = +5 V with VCC- = 0 V, Vicm = VCC/2, Tamb = 25 °C, and RL = 10 kΩ connected to VCC/2 (unless otherwise specified) (continued) Symbol Parameter Conditions Min. Typ. 700 850 Max.
TSX56x, TSX56xA Electrical characteristics Table 6. Electrical characteristics at VCC+ = +16 V with VCC- = 0 V, Vicm = VCC/2, Tamb = 25 °C, and RL = 10 kΩ connected to VCC/2 (unless otherwise specified) Symbol Parameter Conditions Min. Typ. Max. Unit DC performance Vio Offset voltage TSX56xA, T = 25 °C 600 TSX56xA, -40 °C < T < 125 °C 1800 TSX56x, T = 25 °C 1 TSX56x, -40 °C < T < 125 °C ΔVio/ΔT Input offset voltage drift 2.
Electrical characteristics TSX56x, TSX56xA Table 6. Electrical characteristics at VCC+ = +16 V with VCC- = 0 V, Vicm = VCC/2, Tamb = 25 °C, and RL = 10 kΩ connected to VCC/2 (unless otherwise specified) (continued) Symbol Parameter Conditions Min. Typ. 750 900 Max.
TSX56x, TSX56xA Electrical characteristics Figure 3. Input offset voltage distribution at VCC = 16 V and Vicm = 8 V Figure 2. Supply current vs. supply voltage at Vicm = VCC/2 Figure 4. Input offset voltage temperature Figure 5. Input offset voltage vs. input common coefficient distribution at VCC = 16 V, Vicm = 8 V mode voltage at VCC = 12 V Figure 6. Input offset voltage vs.
Electrical characteristics TSX56x, TSX56xA Figure 7. Output current vs. output voltage at VCC = 3.3 V Figure 8. Output current vs. output voltage at VCC = 5 V Figure 9. Output current vs. output voltage at VCC = 16 V Figure 10. Bode diagram at VCC = 3.3 V Figure 11. Bode diagram at VCC = 5 V Figure 12.
TSX56x, TSX56xA Electrical characteristics Figure 13. Phase margin vs. capacitive load at VCC = 12 V Figure 14. GBP vs. input common mode voltage at VCC = 12 V Figure 15. Avd vs. input common mode voltage at VCC = 12 V Figure 16. Slew rate vs. supply voltage Figure 17. Noise vs. frequency at VCC = 3.3 V Figure 18. Noise vs.
Electrical characteristics TSX56x, TSX56xA Figure 19. Noise vs. frequency at VCC = 16 V Figure 20. Distortion + noise vs. output voltage amplitude Figure 21. Distortion + noise vs. amplitude at Vicm = VCC/2 and VCC = 12 V Figure 22. Distortion + noise vs.
TSX56x, TSX56xA Application information 4 Application information 4.1 Operating voltages The amplifiers of the TSX56x and TSX56xA series can operate from 3 V to 16 V. Their parameters are fully specified at 3.3 V, 5 V and 16 V power supplies. However, the parameters are very stable in the full VCC range. Additionally, the main specifications are guaranteed in extended temperature ranges from -40 to +125 ° C. 4.
Application information 4.4 TSX56x, TSX56xA Long term input offset voltage drift To evaluate product reliability, two types of stress acceleration are used: • Voltage acceleration, by changing the applied voltage • Temperature acceleration, by changing the die temperature (below the maximum junction temperature allowed by the technology) with the ambient temperature. The voltage acceleration has been defined based on JEDEC results, and is defined using Equation 2.
TSX56x, TSX56xA Application information Equation 5 Months = A F × 1000 h × 12 months ⁄ ( 24 h × 365.25 days ) To evaluate the op-amp reliability, a follower stress condition is used where VCC is defined as a function of the maximum operating voltage and the absolute maximum rating (as recommended by JEDEC rules). The Vio drift (in µV) of the product after 1000 h of stress is tracked with parameters at different measurement conditions (see Equation 6).
Package information 5 TSX56x, TSX56xA Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.
TSX56x, TSX56xA 5.1 Package information SOT23-5 package information Figure 23. SOT23-5 package mechanical drawing Table 7. SOT23-5 package mechanical data Dimensions Ref. A Millimeters Inches Min. Typ. Max. Min. Typ. Max. 0.90 1.20 1.45 0.035 0.047 0.057 A1 0.15 0.006 A2 0.90 1.05 1.30 0.035 0.041 0.051 B 0.35 0.40 0.50 0.013 0.015 0.019 C 0.09 0.15 0.20 0.003 0.006 0.008 D 2.80 2.90 3.00 0.110 0.114 0.118 D1 1.90 0.075 e 0.95 0.037 E 2.60 2.80 3.
Package information 5.2 TSX56x, TSX56xA DFN8 2x2 package information Figure 24. DFN8 2x2 package mechanical drawing ' $ % & [ ( 3,1 ,1'(; $5($ & [ 723 9,(: $ $ & & 6($7,1* 3/$1( 6,'( 9,(: & H E SOFV 3,1 ,1'(; $5($ & $ % / 3LQ ,' %27720 9,(: *$06 &% Table 8. DFN8 2x2 package mechanical data Dimensions Ref. Inches Min. Typ. Max. Min. Typ. Max. A 0.70 0.75 0.80 0.028 0.030 0.031 A1 0.00 0.02 0.05 0.000 0.001 0.
TSX56x, TSX56xA 5.3 Package information MiniSO8 package information Figure 25. MiniSO8 package mechanical drawing Table 9. MiniSO8 package mechanical data Dimensions Symbol Millimeters Min. Typ. A Inches Max. Min. Typ. 1.10 A1 0 A2 0.75 b Max. 0.043 0.15 0 0.95 0.030 0.22 0.40 0.009 0.016 c 0.08 0.23 0.003 0.009 D 2.80 3.00 3.20 0.11 0.118 0.126 E 4.65 4.90 5.15 0.183 0.193 0.203 E1 2.80 3.00 3.10 0.11 0.118 0.122 e L 0.85 0.65 0.40 0.60 0.006 0.
Package information 5.4 TSX56x, TSX56xA SO8 package information Figure 26. SO8 package mechanical drawing Table 10. SO8 package mechanical data Dimensions Ref. Millimeters Min. Typ. A Max. Min. Typ. 1.75 0.25 Max. 0.069 A1 0.10 A2 1.25 b 0.28 0.48 0.011 0.019 c 0.17 0.23 0.007 0.010 D 4.80 4.90 5.00 0.189 0.193 0.197 E 5.80 6.00 6.20 0.228 0.236 0.244 E1 3.80 3.90 4.00 0.150 0.154 0.157 e 0.004 0.010 0.049 1.27 0.050 h 0.25 0.50 0.010 0.020 L 0.
TSX56x, TSX56xA QFN16 3x3 package information Figure 27. QFN16 3x3 package mechanical drawing ' $ % DDD & [ ( ,1'(; $5($ ' [( DDD & [ 723 9,(: $ FFF & & $ 5.
Package information TSX56x, TSX56xA Table 11. QFN16 3x3 package mechanical data Dimensions Ref. Millimeters Min. Max. Min. Typ. Max. A 0.50 0.65 0.020 0.026 A1 0 0.05 0 0.002 b 0.18 0.30 0.007 0.25 0.010 D 3.00 0.118 E 3.00 0.118 e 0.50 0.020 L 24/28 Typ. Inches 0.30 0.50 0.012 0.012 0.020 aaa 0.15 0.006 bbb 0.10 0.004 ccc 0.10 0.004 ddd 0.05 0.002 eee 0.08 0.
TSX56x, TSX56xA 5.6 Package information TSSOP14 package information Figure 28. TSSOP14 package mechanical drawing Table 12. TSSOP14 package mechanical data Dimensions Symbol Millimeters Min. Typ. A Inches Max. Min. Typ. 1.20 A1 0.05 A2 0.80 b Max. 0.047 0.15 0.002 0.004 0.006 1.05 0.031 0.039 0.041 0.19 0.30 0.007 0.012 c 0.09 0.20 0.004 0.0089 D 4.90 5.00 5.10 0.193 0.197 0.201 E 6.20 6.40 6.60 0.244 0.252 0.260 E1 4.30 4.40 4.50 0.169 0.173 0.
Ordering information 6 TSX56x, TSX56xA Ordering information Table 13.
TSX56x, TSX56xA 7 Revision history Revision history Table 14. Document revision history Date Revision 06-Jun-2012 1 Initial release. 2 Added TSX562, TSX564, TSX562A, and TSX564A devices. Updated Features, Description, Figure 1, Table 1 (added DFN8, MiniSO8, QFN16, and TSSOP14 package). Updated Table 1 (updated ESD MM values). Updated Table 4 and Table 5 (added footnotes), Section 5 (added Figure 24 to Figure 28 and Table 8 to Table 12), Table 13 (added dual and quad devices).
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