Datasheet

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This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to

change without notice.

March 2013 DocID023708 Rev 2 1/29

TSV731, TSV732, TSV734

High accuracy (200 μV) micropower 60 μA, 900 kHz

5 V CMOS operational amplifiers

Datasheet - preliminary data

Features

• Low offset voltage: 200 µV max.

• Low power consumption: 60 µA at 5 V

• Low supply voltage: 1.5 V to 5.5 V

• Gain bandwidth product: 900 kHz typ.

• Low input bias current: 1 pA typ.

• Rail-to-rail input and output

• EMI hardened operational amplifiers

• High tolerance to ESD: 4 kV HBM

• Extended temperature range: -40 to +125 °C

Benefits

• Higher accuracy without calibration

• Energy saving

• Guaranteed operation on low-voltage battery

Summary of content (29 pages)

PAGE 1
TSV731, TSV732, TSV734 High accuracy (200 μV) micropower 60 μA, 900 kHz 5 V CMOS operational amplifiers Datasheet - preliminary data Benefits Single (TSV731) • Higher accuracy without calibration • Energy saving • Guaranteed operation on low-voltage battery SC70-5 Related products • See the TSV71 series (150 kHz for 14 μA) for more power savings Dual (TSV732) Applications • Battery powered applications DFN8 2x2 MiniSO-8 • Portable devices • Signal conditioning Quad (TSV734) • Active filtering • M
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Contents TSV731, TSV732, TSV734 Contents 1 Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Absolute maximum ratings and operating conditions . . . . . . . . . . . . . 4 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 5 4.1 Operating voltages . . . . . . . . . . . . . . . . . .
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TSV731, TSV732, TSV734 Pin connections Figure 1.
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Absolute maximum ratings and operating conditions 2 TSV731, TSV732, TSV734 Absolute maximum ratings and operating conditions Table 1. Absolute maximum ratings (AMR) Symbol VCC Vid Vin Iin Tstg Rthja Rthjc Tj Parameter Supply voltage (2) ±VCC V (3) VCC- - 0.2 to VCC++ 0.
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TSV731, TSV732, TSV734 Absolute maximum ratings and operating conditions Table 2. Operating conditions Symbol Parameter VCC Supply voltage Vicm Common mode input voltage range Toper Operating free air temperature range Value 1.5 to 5.5 DocID023708 Rev 2 VCC- - 0.1 to VCC+ + 0.
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Electrical characteristics 3 TSV731, TSV732, TSV734 Electrical characteristics Table 3. Electrical characteristics at VCC+ = 1.8 V with VCC- = 0 V, Vicm = VCC/2, T = 25 °C, and RL = 10 kΩ connected to VCC/2 (unless otherwise specified) Symbol Parameter Conditions Min. Typ. Max.
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TSV731, TSV732, TSV734 Electrical characteristics Table 3. Electrical characteristics at VCC+ = 1.8 V with VCC- = 0 V, Vicm = VCC/2, T = 25 °C, and RL = 10 kΩ connected to VCC/2 (unless otherwise specified) (continued) Symbol Parameter Conditions Min. Typ. 700 850 Max.
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Electrical characteristics TSV731, TSV732, TSV734 Table 4. Electrical characteristics at VCC+ = 3.3 V with VCC- = 0 V, Vicm = VCC/2, T = 25 °C, and RL = 10 kΩ connected to VCC/2 (unless otherwise specified) Symbol Parameter Conditions Min. Typ. Max. Unit DC performance Vio Input offset voltage T = 25 °C 200 -40 °C < T< 85 °C 500 -40 °C < T< 125 °C ΔVio/ΔT ΔVio 650 (1) Input offset voltage drift -40 °C < T< 125 °C Long-term input offset voltage drift T = 25 °C(2) 4.
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TSV731, TSV732, TSV734 Electrical characteristics Table 4. Electrical characteristics at VCC+ = 3.3 V with VCC- = 0 V, Vicm = VCC/2, T = 25 °C, and RL = 10 kΩ connected to VCC/2 (unless otherwise specified) (continued) Symbol Parameter Conditions Min. Typ. 700 850 Max.
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Electrical characteristics TSV731, TSV732, TSV734 Table 5. Electrical characteristics at VCC+ = 5 V with VCC- = 0 V, Vicm = VCC/2, T = 25 °C, and RL = 10 kΩ connected to VCC/2 (unless otherwise specified) Symbol Parameter Conditions Min. Typ. Max. Unit DC performance Vio Input offset voltage T = 25 °C 200 -40 °C < T< 85 °C 500 -40 °C < T< 125 °C ΔVio/ΔT ΔVio 650 (1) Input offset voltage drift -40 °C < T< 125 °C Long-term input offset voltage drift T = 25 °C(2) 4.
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TSV731, TSV732, TSV734 Electrical characteristics Table 5. Electrical characteristics at VCC+ = 5 V with VCC- = 0 V, Vicm = VCC/2, T = 25 °C, and RL = 10 kΩ connected to VCC/2 (unless otherwise specified) (continued) Symbol Parameter Conditions Min. Typ. 700 900 Max. Unit AC performance GBP Gain bandwidth product Fu Unity gain frequency Φm Phase margin Gm Gain margin SR Slew rate(5) ∫ en Low-frequency peak-to-peak Bandwidth: f = 0.
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Electrical characteristics TSV731, TSV732, TSV734 Figure 2. Supply current vs. supply voltage at Vicm = VCC/2 Figure 3. Input offset voltage distribution at VCC = 5 V, Vicm = VCC/2 70 60 3RSXODWLRQ Supply current (µA) 80 50 T = 125 ˚C 40 T = -40 ˚C T = 25 ˚C 30 20 10 2.0 2.5 3.0 3.5 4.0 4.5 Supply voltage (V) 5.0 5.5 ,QSXW RIIVHW YROWDJH 9 Figure 4. Input offset voltage distribution at VCC = 3.
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TSV731, TSV732, TSV734 Electrical characteristics Figure 8. Output current vs. output voltage at VCC = 1.5 V Figure 9. Output current vs. output voltage at VCC = 5 V 6LQN 9 9 LG 9 9 LG 6LQN 2XWSXW FXUUHQW P$ 9&& 9 7 & 7 & 7 & 7 & 7 & 6RXUFH 9LG 9 Figure 10. Output current vs.
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Electrical characteristics TSV731, TSV732, TSV734 Figure 14. Positive slew rate Figure 15. Negative slew rate 7 & 2XWSXW YROWDJH 9 2XWSXW YROWDJH 9 7 & 9&& 9 9LFP 9FF &O S) 7 & 7LPH V 7 & 7 & Figure 16. Slew rate vs.
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TSV731, TSV732, TSV734 Electrical characteristics Figure 20. THD+N vs. output voltage Figure 21. Output impedance vs.
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Application information TSV731, TSV732, TSV734 4 Application information 4.1 Operating voltages The TSV73x series of devices can operate from 1.5 V to 5.5 V. The parameters are fully specified for 1.8 V, 3.3 V, and 5 V power supplies. However, they are very stable in the full VCC range and several characterization curves show TSV73x device characteristics at 1.5 V. In addition, the main specifications are guaranteed in the extended temperature range from -40 °C to +125 °C. 4.
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TSV731, TSV732, TSV734 4.5 Application information Long-term input offset voltage drift To evaluate product reliability, two types of stress acceleration are used: • Voltage acceleration, by changing the applied voltage • Temperature acceleration, by changing the die temperature (below the maximum junction temperature allowed by the technology) with the ambient temperature. The voltage acceleration has been defined based on JEDEC results, and is defined using Equation 2.
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Application information TSV731, TSV732, TSV734 Equation 5 Months = A F × 1000 h × 12 months ⁄ ( 24 h × 365.25 days ) To evaluate the op-amp reliability, a follower stress condition is used where VCC is defined as a function of the maximum operating voltage and the absolute maximum rating (as recommended by JEDEC rules). The Vio drift (in µV) of the product after 1000 h of stress is tracked with parameters at different measurement conditions (see Equation 6).
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TSV731, TSV732, TSV734 4.6 Application information Initialization time The TSV73x series of devices use a proprietary trimming topology that is initiated at each device power-up and allows excellent Vio performance to be achieved. The initialization time is defined as the delay after power-up which guarantees operation within specified performances. During this period, the current consumption (ICC) and the input offset voltage (Vio) can be different to the typical ones. Figure 22.
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Application information 4.8 TSV731, TSV732, TSV734 Macromodel Accurate macromodels of the TSV73x devices are available on the STMicroelectronics’ website at www.st.com. These model are a trade-off between accuracy and complexity (that is, time simulation) of the TSV73x operational amplifiers. They emulate the nominal performance of a typical device within the specified operating conditions mentioned in the datasheet.
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TSV731, TSV732, TSV734 5 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.
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Package information 5.1 TSV731, TSV732, TSV734 SC70-5 package information Figure 23. SC70-5 package mechanical drawing SIDE VIEW DIMENSIONS IN MM GAUGE PLANE COPLANAR LEADS SEATING PLANE TOP VIEW Table 7. SC70-5 package mechanical data Dimensions Symbol Millimeters Min. 22/29 Typ. Inches Max. Min. 0.032 A 0.80 1.10 A1 0 0.10 A2 0.80 b 0.90 Typ. Max. 0.043 0.004 1.00 0.032 0.035 0.15 0.30 0.006 0.012 c 0.10 0.22 0.004 0.009 D 1.80 2.00 2.20 0.071 0.079 0.087 E 1.
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TSV731, TSV732, TSV734 DFN8 2x2 package information Figure 24. DFN8 2x2 package mechanical drawing ' $ % & [ ( 3,1 ,1'(; $5($ & [ 723 9,(: $ & $ & 6($7,1* 3/$1( 6,'( 9,(: & H E SOFV 3,1 ,1'(; $5($ & $ % 3LQ ,' / 5.2 Package information %27720 9,(: *$06 &% Table 8. DFN8 2x2 package mechanical data Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.70 0.75 0.80 0.028 0.030 0.031 A1 0.00 0.02 0.
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Package information 5.3 TSV731, TSV732, TSV734 MiniSO-8 package information Figure 25. MiniSO-8 package mechanical drawing Table 9. MiniSO-8 package mechanical data Dimensions Ref. Millimeters Min. Typ. A Max. Min. Typ. 1.1 A1 0 A2 0.75 b Max. 0.043 0.15 0 0.95 0.030 0.22 0.40 0.009 0.016 c 0.08 0.23 0.003 0.009 D 2.80 3.00 3.20 0.11 0.118 0.126 E 4.65 4.90 5.15 0.183 0.193 0.203 E1 2.80 3.00 3.10 0.11 0.118 0.122 e L 0.85 0.65 0.40 0.60 0.006 0.
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TSV731, TSV732, TSV734 5.4 Package information QFN16 3x3 package information Figure 26.
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Package information TSV731, TSV732, TSV734 Table 10. QFN16 3x3 mm package mechanical data (pitch 0.5 mm) Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.80 0.90 1.00 0.031 0.035 0.039 A1 0 0.05 0 A3 0.20 b 0.18 D 2.90 D2 1.50 E 2.90 E2 1.50 e L 3.00 3.00 0.008 0.30 0.007 3.10 0.114 1.80 0.059 3.10 0.114 1.80 0.059 0.50 0.30 0.002 0.012 0.118 0.071 0.118 0.122 0.071 0.020 0.50 0.012 Figure 27.
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TSV731, TSV732, TSV734 5.5 Package information TSSOP14 package information Figure 28. TSSOP14 package mechanical drawing Table 11. TSSOP14 package mechanical data Dimensions Ref. Millimeters Min. Typ. A Inches Max. Min. Typ. 1.20 A1 0.05 A2 0.80 b Max. 0.047 0.15 0.002 0.004 0.006 1.05 0.031 0.039 0.041 0.19 0.30 0.007 0.012 c 0.09 0.20 0.004 0.0089 D 4.90 5.00 5.10 0.193 0.197 0.201 E 6.20 6.40 6.60 0.244 0.252 0.260 E1 4.30 4.40 4.50 0.169 0.173 0.
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Ordering information 6 TSV731, TSV732, TSV734 Ordering information Table 12. Order codes Order code Temperature range TSV731ICT TSV732IQ2T TSV732IST -40° C to +125° C TSV734IQ4T TSV734IPT 7 Package Packaging Marking SC70-5 K1X DFN8 2x2 K1X MiniSO8 Tape and reel V732 QFN16 3x3 K1X TSSOP14 TSV734IP Revision history Table 13. Document revision history Date Revision 24-Sep-2012 1 Initial internal release 2 Initial public release.
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TSV731, TSV732, TSV734 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale.