Datasheet
Table Of Contents
- Table 1. Device summary
- 1 Package pin connections
- 2 Absolute maximum ratings and operating conditions
- 3 Electrical characteristics
- Table 4. Electrical characteristics at VCC+ = +2.7 V with VCC- = 0 V, Vicm = VCC/2, T = 25 C, and RL = 10 kW connected to VCC/2 (unless otherwise specified)
- Table 5. Electrical characteristics at VCC+ = +3.3 V with VCC- = 0 V, Vicm = VCC/2, T = 25 C, and RL = 10 kW connected to VCC/2 (unless otherwise specified)
- Table 6. Electrical characteristics at VCC+ = +5 V with VCC- = 0 V, Vicm = VCC/2, T = 25 C, and RL = 10 kW connected to VCC/2 (unless otherwise specified)
- Figure 2. Supply current vs. supply voltage at Vicm = VCC/2
- Figure 3. Input offset voltage distribution at VCC = 5 V, Vicm = 2.5 V
- Figure 4. Input offset voltage temperature coefficient distribution
- Figure 5. Input offset voltage vs. input common mode voltage at VCC = 5 V
- Figure 6. Input offset voltage vs. temperature at VCC = 5 V
- Figure 7. Output current vs. output voltage at VCC = 2.7 V
- Figure 8. Output current vs. output voltage at VCC = 5.5 V
- Figure 9. Bode diagram at VCC = 2.7 V, RL = 10 kW
- Figure 10. Bode diagram at VCC = 2.7 V, RL = 2 kW
- Figure 11. Bode diagram at VCC = 5.5 V, RL = 10 kW
- Figure 12. Bode diagram at VCC = 5.5 V, RL = 2 kW
- Figure 13. Noise vs. frequency
- Figure 14. Positive slew rate vs. supply voltage
- Figure 15. Negative slew rate vs. supply voltage
- Figure 16. THD+N vs. frequency at VCC = 2.7 V
- Figure 17. THD+N vs. frequency at VCC = 5.5 V
- Figure 18. THD+N vs. output voltage at VCC = 2.7 V
- Figure 19. THD+N vs. output voltage at VCC = 5.5 V
- Figure 20. Output impedance versus frequency in closed-loop configuration
- Figure 21. Response to a 100 mV input step for gain = 1 at VCC = 5.5 V rising edge
- Figure 22. Response to a 100 mV input step for gain = 1 at VCC = 5.5 V falling edge
- Figure 23. PSRR vs. frequency at VCC = 2.7 V
- Figure 24. PSRR vs. frequency at VCC = 5.5 V
- 4 Application information
- 5 Package information
- Figure 30. SC70-5 package outline
- Table 7. SC70-5 package mechanical data
- Figure 31. DFN8 2 x 2 x 0.6, 8 pitch, 0.5 mm package outline
- Table 8. DFN8 2 x 2 x 0.6, 8 pitch, 0.5 mm package mechanical data
- Figure 32. DFN8 2 x 2 0.6, 8 pitch, 0.5 mm footprint recommendation
- Figure 33. MiniSO8 package outline
- Table 9. MiniSO8 package mechanical data
- Figure 34. QFN16 - 3 x 3 x 0.9 mm, pad 1.7 - package outline
- Table 10. QFN16 - 3 x 3 x 0.9 mm, pad 1.7 - package mechanical data
- Figure 35. QFN16 - 3 x 3 x 0.9 mm, pad 1.7 - footprint recommendation
- Figure 36. TSSOP14 body 4.40 mm, lead pitch 0.65 mm - package outline
- Table 11. TSSOP14 body 4.40 mm, lead pitch 0.65 mm - package mechanical data
- 6 Ordering information
- 7 Revision history
TSV521, TSV522, TSV524, TSV521A, TSV522A, TSV524A Package information
Doc ID 022743 Rev 1 25/27
Figure 36. TSSOP14 body 4.40 mm, lead pitch 0.65 mm - package outline
Table 11. TSSOP14 body 4.40 mm, lead pitch 0.65 mm - package mechanical data
Symbol
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 1.20 0.047
A1 0.05 0.15 0.002 0.004 0.006
A2 0.80 1.00 1.05 0.031 0.039 0.041
b 0.19 0.30 0.007 0.012
c 0.09 0.20 0.004 0.0089
D 4.90 5.00 5.10 0.193 0.197 0.201
E 6.20 6.40 6.60 0.244 0.252 0.260
E1 4.30 4.40 4.50 0.169 0.173 0.176
e 0.65 0.0256 BSC
L 0.45 0.60 0.75
L1 1.00
k 0° 8° 0° 8°
aaa 0.10 0.018 0.024 0.030
433/0