Datasheet
Table Of Contents
- Table 1. Device summary
- 1 Package pin connections
- 2 Absolute maximum ratings and operating conditions
- 3 Electrical characteristics
- Table 4. Electrical characteristics at VCC+ = +2.7 V with VCC- = 0 V, Vicm = VCC/2, T = 25 C, and RL = 10 kW connected to VCC/2 (unless otherwise specified)
- Table 5. Electrical characteristics at VCC+ = +3.3 V with VCC- = 0 V, Vicm = VCC/2, T = 25 C, and RL = 10 kW connected to VCC/2 (unless otherwise specified)
- Table 6. Electrical characteristics at VCC+ = +5 V with VCC- = 0 V, Vicm = VCC/2, T = 25 C, and RL = 10 kW connected to VCC/2 (unless otherwise specified)
- Figure 2. Supply current vs. supply voltage at Vicm = VCC/2
- Figure 3. Input offset voltage distribution at VCC = 5 V, Vicm = 2.5 V
- Figure 4. Input offset voltage temperature coefficient distribution
- Figure 5. Input offset voltage vs. input common mode voltage at VCC = 5 V
- Figure 6. Input offset voltage vs. temperature at VCC = 5 V
- Figure 7. Output current vs. output voltage at VCC = 2.7 V
- Figure 8. Output current vs. output voltage at VCC = 5.5 V
- Figure 9. Bode diagram at VCC = 2.7 V, RL = 10 kW
- Figure 10. Bode diagram at VCC = 2.7 V, RL = 2 kW
- Figure 11. Bode diagram at VCC = 5.5 V, RL = 10 kW
- Figure 12. Bode diagram at VCC = 5.5 V, RL = 2 kW
- Figure 13. Noise vs. frequency
- Figure 14. Positive slew rate vs. supply voltage
- Figure 15. Negative slew rate vs. supply voltage
- Figure 16. THD+N vs. frequency at VCC = 2.7 V
- Figure 17. THD+N vs. frequency at VCC = 5.5 V
- Figure 18. THD+N vs. output voltage at VCC = 2.7 V
- Figure 19. THD+N vs. output voltage at VCC = 5.5 V
- Figure 20. Output impedance versus frequency in closed-loop configuration
- Figure 21. Response to a 100 mV input step for gain = 1 at VCC = 5.5 V rising edge
- Figure 22. Response to a 100 mV input step for gain = 1 at VCC = 5.5 V falling edge
- Figure 23. PSRR vs. frequency at VCC = 2.7 V
- Figure 24. PSRR vs. frequency at VCC = 5.5 V
- 4 Application information
- 5 Package information
- Figure 30. SC70-5 package outline
- Table 7. SC70-5 package mechanical data
- Figure 31. DFN8 2 x 2 x 0.6, 8 pitch, 0.5 mm package outline
- Table 8. DFN8 2 x 2 x 0.6, 8 pitch, 0.5 mm package mechanical data
- Figure 32. DFN8 2 x 2 0.6, 8 pitch, 0.5 mm footprint recommendation
- Figure 33. MiniSO8 package outline
- Table 9. MiniSO8 package mechanical data
- Figure 34. QFN16 - 3 x 3 x 0.9 mm, pad 1.7 - package outline
- Table 10. QFN16 - 3 x 3 x 0.9 mm, pad 1.7 - package mechanical data
- Figure 35. QFN16 - 3 x 3 x 0.9 mm, pad 1.7 - footprint recommendation
- Figure 36. TSSOP14 body 4.40 mm, lead pitch 0.65 mm - package outline
- Table 11. TSSOP14 body 4.40 mm, lead pitch 0.65 mm - package mechanical data
- 6 Ordering information
- 7 Revision history

Application information TSV521, TSV522, TSV524, TSV521A, TSV522A, TSV524A
16/27 Doc ID 022743 Rev 1
4.7 Long term input offset voltage drift
In a product reliability evaluation, two types of stress acceleration are usable:
● Voltage acceleration, by changing the applied voltage
● Temperature acceleration, by changing the die temperature (below the maximum
junction temperature allowed by the technology) with the ambient temperature
The voltage acceleration has been defined based on JEDEC results, and is defined by:
Equation 2
where:
A
FV
is the voltage acceleration factor
ß is the voltage acceleration constant in 1/V, constant technology parameter
V
S
is the stress voltage used for the accelerated test
V
U
is the use voltage for the application
The temperature acceleration is driven by the Arrhenius model, and is defined by:
Equation 3
where:
A
FT
is the temperature acceleration factor
E
a
is the activation energy of the technology based on failure rate
k is the Boltzmann’s constant
T
U
is the temperature of the die when V
U
is used
T
S
is the temperature of the die under temperature stress
The final acceleration factor, A
F
, is the multiplication of these two acceleration factors, which
is:
Equation 4
A
F
= A
FT
x A
FV
Based on this A
F
, calculated following the defined usage temperature and usage voltage of
the product, the 1000 h duration of the stress corresponds to a number of equivalent months
of usage.
Equation 5
Months = A
F
x 1000 h x 12 months / (24h x 365.25 days)
A
FV
e
β V
S
V
U
–()⋅
=
A
FT
e
E
a
k
------
1
T
U
------
1
T
S
------–
⎝⎠
⎛⎞
⋅
=