Datasheet
Table Of Contents
- Table 1. Device summary
- 1 Package pin connections
- 2 Absolute maximum ratings and operating conditions
- 3 Electrical characteristics
- Table 4. Electrical characteristics at VCC+ = +2.7 V with VCC- = 0 V, Vicm = VCC/2, T = 25 C, and RL = 10 kW connected to VCC/2 (unless otherwise specified)
- Table 5. Electrical characteristics at VCC+ = +3.3 V with VCC- = 0 V, Vicm = VCC/2, T = 25 C, and RL = 10 kW connected to VCC/2 (unless otherwise specified)
- Table 6. Electrical characteristics at VCC+ = +5 V with VCC- = 0 V, Vicm = VCC/2, T = 25 C, and RL = 10 kW connected to VCC/2 (unless otherwise specified)
- Figure 2. Supply current vs. supply voltage at Vicm = VCC/2
- Figure 3. Input offset voltage distribution at VCC = 5 V, Vicm = 2.5 V
- Figure 4. Input offset voltage temperature coefficient distribution
- Figure 5. Input offset voltage vs. input common mode voltage at VCC = 5 V
- Figure 6. Input offset voltage vs. temperature at VCC = 5 V
- Figure 7. Output current vs. output voltage at VCC = 2.7 V
- Figure 8. Output current vs. output voltage at VCC = 5.5 V
- Figure 9. Bode diagram at VCC = 2.7 V, RL = 10 kW
- Figure 10. Bode diagram at VCC = 2.7 V, RL = 2 kW
- Figure 11. Bode diagram at VCC = 5.5 V, RL = 10 kW
- Figure 12. Bode diagram at VCC = 5.5 V, RL = 2 kW
- Figure 13. Noise vs. frequency
- Figure 14. Positive slew rate vs. supply voltage
- Figure 15. Negative slew rate vs. supply voltage
- Figure 16. THD+N vs. frequency at VCC = 2.7 V
- Figure 17. THD+N vs. frequency at VCC = 5.5 V
- Figure 18. THD+N vs. output voltage at VCC = 2.7 V
- Figure 19. THD+N vs. output voltage at VCC = 5.5 V
- Figure 20. Output impedance versus frequency in closed-loop configuration
- Figure 21. Response to a 100 mV input step for gain = 1 at VCC = 5.5 V rising edge
- Figure 22. Response to a 100 mV input step for gain = 1 at VCC = 5.5 V falling edge
- Figure 23. PSRR vs. frequency at VCC = 2.7 V
- Figure 24. PSRR vs. frequency at VCC = 5.5 V
- 4 Application information
- 5 Package information
- Figure 30. SC70-5 package outline
- Table 7. SC70-5 package mechanical data
- Figure 31. DFN8 2 x 2 x 0.6, 8 pitch, 0.5 mm package outline
- Table 8. DFN8 2 x 2 x 0.6, 8 pitch, 0.5 mm package mechanical data
- Figure 32. DFN8 2 x 2 0.6, 8 pitch, 0.5 mm footprint recommendation
- Figure 33. MiniSO8 package outline
- Table 9. MiniSO8 package mechanical data
- Figure 34. QFN16 - 3 x 3 x 0.9 mm, pad 1.7 - package outline
- Table 10. QFN16 - 3 x 3 x 0.9 mm, pad 1.7 - package mechanical data
- Figure 35. QFN16 - 3 x 3 x 0.9 mm, pad 1.7 - footprint recommendation
- Figure 36. TSSOP14 body 4.40 mm, lead pitch 0.65 mm - package outline
- Table 11. TSSOP14 body 4.40 mm, lead pitch 0.65 mm - package mechanical data
- 6 Ordering information
- 7 Revision history

This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.
June 2012 Doc ID 022743 Rev 1 1/27
27
TSV521, TSV522, TSV524,
TSV521A, TSV522A, TSV524A
High merit factor (1.15 MHz for 45 µA) CMOS op amps
Datasheet − preliminary data
Features
■ Gain bandwidth product: 1.15 MHz typ. at 5 V
■ Low power consumption: 45 µA typ. at 5 V
■ Rail-to-rail input and output
■ Low input bias current: 1 pA typ.
■ Supply voltage: 2.7 to 5.5 V
■ Low offset voltage: 800 µV max.
■ Unity gain stable on 100 pF capacitor
■ Automotive grade
Benefits
■ Increased lifetime in battery powered
applications
■ Easy interfacing with high impedance sensors
Related products
■ See TSV6x series for lower minimum supply
voltage (1.5 V)
■ See LMV82x series for higher gain bandwidth
products (5.5 MHz)
Applications
■ Battery powered applications
■ Portable devices
■ Automotive signal conditioning
■ Active filtering
■ Medical instrumentation
Description
The TSV52x series of operational amplifiers
offers low voltage operation and rail-to-rail input
and output. The TSV521 device is the single
version, the TSV522 device the dual version, and
the TSV524 device the quad version, with pinouts
compatible with industry standards.
The TSV52x series offers an outstanding
speed/power consumption ratio, 1.15 MHz gain
bandwidth product while consuming only 45 µA at
5 V. The devices are housed in the smallest
industrial packages.
These features make the TSV52x family ideal for
sensor interfaces, battery supplied and portable
applications. The wide temperature range and
high ESD tolerance facilitate their use in harsh
automotive applications.
Table 1. Device summary
Standard V
io
Enhanced V
io
Single TSV521 TSV521A
Dual TSV522 TSV522A
Quad TSV524 TSV524A
TSSOP14
MiniSO8
SC70-5
DF
N
8 2 x 2
QF
N16
3 x 3
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