Datasheet

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This is information on a product in full production.

July 2013 DocID6031 Rev 9 1/17

TS971, TS972, TS974

Output rail-to-rail very low noise operational amplifier

Datasheet - production data

Features

• Rail-to-rail output voltage swing

±2.4 V at V

= ±2.5 V

• Very low noise level: 4 nV/√ Hz

• Ultra low distortion: 0.003 %

• High dynamic features: 12 MHz, 4 V/µs

• Operating range: 2.7 to 10 V

• ESD protection (2 kV)

• Latch-up immunity (class A)

Applications

• Portable devices (CD players, PDAs)

• Portable communication (cell phones, pagers)

• Instrumentation and sensing tehnology

• Professional audio circuits

Description

The TS97x family of operational amplifiers

operates with voltages as low as ±1.35

V and

features output rail-to-rail signal swing. The

TS97x devices are particularly well suited for

portable and battery supplied equipment. Very

low noise and low distortion characteristics make

them ideal for audio pre-amplification.

The TS97x devices are available in a variety of

packages to suit all types of applications. For

applications where space saving is critical, the

SOT23-5 package (2.8 x 2.9

mm) or the DFN8

package (3

x 3 mm) simplify the board design

because they can be placed everywhere.

(1)

connected to VCC or left floating

The exposed pads of DFN8 3x3 can be(1)

SOT23-5

SO8

SO14, TSSOP14

SO8, TSSOP8

DFN8 3x3

www.st.com

Summary of content (17 pages)

PAGE 1
TS971, TS972, TS974 Output rail-to-rail very low noise operational amplifier Datasheet - production data SOT23-5 Features • Rail-to-rail output voltage swing ±2.4 V at VCC = ±2.5 V • Very low noise level: 4 nV/√ Hz • Ultra low distortion: 0.003 % • High dynamic features: 12 MHz, 4 V/µs SO8 • Operating range: 2.
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Contents TS971, TS972, TS974 Contents 1 Absolute maximum ratings and operating conditions . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.1 SOT23-5 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.2 SO8 package information . . . . . . . . . . . . . . . . . . . . . .
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TS971, TS972, TS974 1 Absolute maximum ratings and operating conditions Absolute maximum ratings and operating conditions Table 1. Absolute maximum ratings (AMR) Symbol VCC Vid Parameter Value Supply voltage(1) 12 Differential input voltage (2) ±1 Vin Input voltage (3) VDD -0.3 to VCC +0.
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Absolute maximum ratings and operating conditions TS971, TS972, TS974 Table 2. Operating conditions Symbol 4/17 Parameter VCC Supply voltage Vicm Common mode input voltage range Toper Operating free air temperature range Value 2.7 to 10 DocID6031 Rev 9 VDD +1.15 to VCC -1.
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TS971, TS972, TS974 2 Electrical characteristics Electrical characteristics Table 3. Electrical characteristics at VCC = +2.5 V, VDD = -2.5 V, Tamb = 25 °C (unless otherwise specified) Symbol Vio Parameter Input offset voltage ΔVio/ΔT Input offset voltage drift Conditions Min. Typ. Max.
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Electrical characteristics 6/17 TS971, TS972, TS974 Figure 1. Input offset voltage distribution Figure 2. Voltage gain and phase vs. frequency VCC = 5 V Figure 3. Voltage gain and phase vs. frequency VCC = 2.7 V Figure 4. THS vs. Vout, VCC = 5 V Figure 5. THD vs. Vout, VCC = 2.7 V Figure 6. THD vs.
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TS971, TS972, TS974 Electrical characteristics Figure 7. Noise voltage vs. frequency Figure 8. Gain bandwidth product vs. Iout Figure 9. Phase margin vs. Iout Figure 10. Phase margin vs. VCC RL = 10 k, CL = 30 pF Figure 11. Phase margin vs. VCC CL = 30, 130 and 250 pF Figure 12. Gain margin vs.
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Package information 3 TS971, TS972, TS974 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.
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TS971, TS972, TS974 3.1 Package information SOT23-5 package information Figure 13. SOT23-5 package outline Table 4. SOT23-5 package mechanical data Dimensions Symbol A Millimeters Inches Min. Typ. Max. Min. Typ. Max. 0.90 1.20 1.45 0.035 0.047 0.057 A1 0.15 0.006 A2 0.90 1.05 1.30 0.035 0.041 0.051 B 0.35 0.40 0.50 0.013 0.015 0.019 C 0.09 0.15 0.20 0.003 0.006 0.008 D 2.80 2.90 3.00 0.110 0.114 0.118 D1 1.90 0.075 e 0.95 0.037 E 2.60 2.80 3.00 0.
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Package information 3.2 TS971, TS972, TS974 SO8 package information Figure 14. SO8 package outline Table 5. SO8 package mechanical data Dimensions Symbol Millimeters Min. Typ. A Max. Min. Typ. 1.75 0.25 Max. 0.069 A1 0.10 A2 1.25 b 0.28 0.48 0.011 0.019 c 0.17 0.23 0.007 0.010 D 4.80 4.90 5.00 0.189 0.193 0.197 E 5.80 6.00 6.20 0.228 0.236 0.244 E1 3.80 3.90 4.00 0.150 0.154 0.157 e 0.004 0.010 0.049 1.27 0.050 h 0.25 0.50 0.010 0.020 L 0.40 1.
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TS971, TS972, TS974 3.3 Package information TSSOP8 package information Figure 15. TSSOP8 package outline Table 6. TSSOP8 package mechanical data Dimensions Symbol Millimeters Min. Typ. A Inches Max. Min. Typ. 1.20 A1 0.05 A2 0.80 b Max. 0.047 0.15 0.002 1.05 0.031 0.19 0.30 0.007 0.012 c 0.09 0.20 0.004 0.008 D 2.90 3.00 3.10 0.114 0.118 0.122 E 6.20 6.40 6.60 0.244 0.252 0.260 E1 4.30 4.40 4.50 0.169 0.173 0.177 e 0.65 k 0° L 0.45 L1 aaa 1.00 0.
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Package information 3.4 TS971, TS972, TS974 DFN8 3x3 exposed pad package information Figure 16. DFN8 3x3 exposed pad package outline (pitch 0.5 mm) Table 7. DFN8 3x3 mm exposed pad package mechanical data (pitch 0.5 mm) Dimensions Symbol A Millimeters Min. Typ. Max. Min. Typ. Max. 0.80 0.90 1.00 0.031 0.035 0.039 0.02 0.05 0.0008 0.0019 0.65 0.80 0.025 0.031 A1 A2 0.55 A3 0.021 0.20 0.008 b 0.18 0.25 0.30 0.007 0.010 0.012 D 2.85 3.00 3.15 0.112 0.118 0.
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TS971, TS972, TS974 3.5 Package information SO14 package information Figure 17. SO14 package outline Table 8. SO14 package mechanical data Dimensions Symbol Millimeters Min. Typ. Inches Max. Min. Typ. Max. A 1.35 1.75 0.05 0.068 A1 0.10 0.25 0.004 0.009 A2 1.10 1.65 0.04 0.06 B 0.33 0.51 0.01 0.02 C 0.19 0.25 0.007 0.009 D 8.55 8.75 0.33 0.34 E 3.80 4.0 0.15 0.15 e 1.27 0.05 H 5.80 6.20 0.22 0.24 h 0.25 0.50 0.009 0.02 L 0.40 1.27 0.015 0.
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Package information 3.6 TS971, TS972, TS974 TSSOP14 package information Figure 18. TSSOP14 package outline Table 9. TSSOP14 package mechanical data Dimensions Symbol Millimeters Min. Typ. A Max. Min. Typ. 1.20 A1 0.05 A2 0.80 b Max. 0.047 0.15 0.002 0.004 0.006 1.05 0.031 0.039 0.041 0.19 0.30 0.007 0.012 c 0.09 0.20 0.004 0.0089 D 4.90 5.00 5.10 0.193 0.197 0.201 E 6.20 6.40 6.60 0.244 0.252 0.260 E1 4.30 4.40 4.50 0.169 0.173 0.176 e L k aaa 1.
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TS971, TS972, TS974 4 Ordering information Ordering information Table 10.
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Revision history 5 TS971, TS972, TS974 Revision history Table 11. Document revision history 16/17 Date Revision Changes 15-Nov- 2002 1 First release. 9-May- 2005 2 Modifications on AMR table (explanation of Vid and Vi limits) 31-Aug-2005 3 PPAP references inserted in the datasheet, see Table 1 on page 2. 9-Dec-2005 4 Thermal resistance junction to case data added in Table 1. on page 3 Missing PPAP references inserted in the datasheet, see Table 10: Order codes.
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TS971, TS972, TS974 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale.