Datasheet

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This is information on a product in full production.

June 2013 DocID5150 Rev 11 1/24

TS922, TS922A

Rail-to-rail, high output current dual operational amplifier

Datasheet - production data

Features

• Rail-to-rail input and output

• Low noise: 9 nV/√

• Low distortion

• High output current: 80 mA

(able to drive 32 Ω loads)

• High-speed: 4 MHz, 1 V/μs

• Operating from 2.7 to 12 V

• Low input offset voltage: 900 μV max.

(TS922A)

• ESD internal protection: 2 kV

• Latch-up immunity

• Macromodel included in this specification

• Dual version available in Flip-chip package

Applications

• Headphone and servo amplifiers

• Sound cards, multimedia systems

• Line drivers, actuator drivers

• Mobile phones and portable equipment

• Instrumentation with low noise as key factor

• Piezoelectric speaker drivers

Description

TS922 and TS922A devices are rail-to-rail dual

BiCMOS operational amplifiers optimized and

fully specified for 3 V and 5

V operation. These

devices have high output currents which allow

low-load impedances to be driven.

Very low noise, low distortion, low offset, and

a high output current capability make these

devices an excellent choice for high quality, low

voltage, or battery operated audio systems.

The devices are stable for capacitive loads up to

500

pF.

SO8

(plastic micropackage)

TSSOP8

(thin shrink small outline package)

Flip-chip with backcoating

DIP8

(plastic package)

MiniSO8

(plastic micropackage)

www.st.com

Summary of content (24 pages)

PAGE 1
TS922, TS922A Rail-to-rail, high output current dual operational amplifier Datasheet - production data Features • Rail-to-rail input and output • Low noise: 9 nV/√Hz • Low distortion J Flip-chip with backcoating • High output current: 80 mA (able to drive 32 Ω loads) • High-speed: 4 MHz, 1 V/μs • Operating from 2.7 to 12 V • Low input offset voltage: 900 μV max.
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Contents TS922, TS922A Contents 1 Pin diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Absolute maximum ratings and operating conditions . . . . . . . . . . . . . 4 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4 TS922, TS922A macromodel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5 4.1 Important note concerning this macromodel . . . . . . . . . . . . . .
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TS922, TS922A 1 Pin diagrams Pin diagrams Figure 1. Pinout for Flip-chip package (top view) OUT2 OUT2 -IN2 +IN2 + V GND CC- VVCC+ CC+ + OUT1 OUT1 Figure 2.
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Absolute maximum ratings and operating conditions 2 TS922, TS922A Absolute maximum ratings and operating conditions Table 1. Absolute maximum ratings (AMR) Symbol VCC Vid Parameter Supply voltage(1) Differential input voltage (2) Tstg Storage temperature V ±1 (3) Input voltage VCC- -0.3 to VCC++0.
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TS922, TS922A Absolute maximum ratings and operating conditions Table 2. Operating conditions Symbol Parameter VCC Supply voltage Vicm Common mode input voltage range Toper Operating free air temperature range Value 2.7 to 12 DocID5150 Rev 11 VCC- -0.2 to VCC+ +0.
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Electrical characteristics 3 TS922, TS922A Electrical characteristics Table 3. Electrical characteristics measured at VCC = +3 V, VCC- = 0 V, Vicm = VCC/2, Tamb = 25 °C, and RL connected to VCC/2 (unless otherwise specified) Symbol Vio Parameter Input offset voltage Test conditions Min. Iib VOH 3 0.9 1.5 Tmin ≤ Tamb ≤ Tmax TS922 TS922A TS922IJ (Flip-chip) 5 1.8 2.
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TS922, TS922A Electrical characteristics Table 3. Electrical characteristics measured at VCC = +3 V, VCC- = 0 V, Vicm = VCC/2, Tamb = 25 °C, and RL connected to VCC/2 (unless otherwise specified) (continued) Symbol Parameter Test conditions φm Phase margin at unit gain Gm Gain margin en Equivalent input noise voltage f = 1 kHz Total harmonic distortion Vout = 2 Vp-p, f = 1 kHz, Av = 1, RL = 600 Ω THD Cs RL = 600 Ω, CL = 100 pF Channel separation DocID5150 Rev 11 Min. Typ. Max.
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Electrical characteristics TS922, TS922A Table 4. Electrical characteristics measured at VCC = 5 V, VCC- = 0 V, Vicm = VCC/2, Tamb = 25 °C, and RL connected to VCC/2 (unless otherwise specified) Symbol Vio Parameter Input offset voltage Conditions Min. Iib VOH 3 0.9 1.5 Tmin ≤ Tamb ≤ Tmax TS922 TS922A TS922IJ (Flip-chip) 5 1.8 2.5 Vout = VCC/2 Tmin ≤ Tamb ≤ Tmax 1 30 30 Input bias current Vout = VCC/2 Tmin ≤ Tamb ≤ Tmax 15 100 100 RL= 10 kΩ Tmin ≤ Tamb ≤ Tmax 4.9 4.
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TS922, TS922A Electrical characteristics Table 4. Electrical characteristics measured at VCC = 5 V, VCC- = 0 V, Vicm = VCC/2, Tamb = 25 °C, and RL connected to VCC/2 (unless otherwise specified) (continued) Symbol THD Cs Parameter Total harmonic distortion Conditions Vout = 2 Vp-p, f = 1 kHz, Av = 1, RL = 600 Ω Channel separation DocID5150 Rev 11 Min. Typ. Max. Unit 0.
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Electrical characteristics TS922, TS922A Figure 3. Output short-circuit current vs. output voltage Figure 4. Total supply current vs. supply voltage Figure 5. Voltage gain and phase vs. frequency Figure 6. Equivalent input noise voltage vs. frequency Phase Cl = 100 pF Gain (dB) Gain 60 20 Phase (deg.) 120 40 0 0 -20 1E+02 1E+03 1E+04 1E+05 1E+06 1E+07 Equivalent input noise (nV/sqrt(Hz) 180 60 30 25 VCC = ±1.5 V RL = 100 Ω 20 15 10 5 0 0.01 0.
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TS922, TS922A Electrical characteristics Figure 9. THD + noise vs. frequency (RL = 32 Ω, Vo = 2 Vpp, VCC = ± 1.5 V) Figure 10. THD + noise vs. output voltage (RL = 600 Ω, f = 1 kHz, VCC = 0/3 V) 10,000 0.7 0.6 THD + noise (%) THD + noise (%) 1,000 0.5 RL = 32 Ω, Vo = 2 Vpp VCC = ±1.5 V, Av = 10 0.4 0.3 0.2 RL = 600 Ω, f = 1 kHz VCC = 0/3 V, Av = -1 0,100 0,010 0.1 0 0.01 0.1 1 10 0,001 100 0 0,2 0,4 0,6 Frequency (kHz) 0,8 1 1,2 Vout (Vrms) Figure 11. THD + noise vs.
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TS922, TS922A macromodel TS922, TS922A 4 TS922, TS922A macromodel 4.1 Important note concerning this macromodel • All models are a trade-off between accuracy and complexity (i.e. simulation time). • Macromodels are not a substitute to breadboarding; rather, they confirm the validity of a design approach and help to select surrounding component values.
PAGE 13
TS922, TS922A 4.3 TS922, TS922A macromodel Macromodel code ** Standard Linear Ics Macromodels, 1996. ** CONNECTIONS: * 1 INVERTING INPUT * 2 NON-INVERTING INPUT * 3 OUTPUT * 4 POSITIVE POWER SUPPLY * 5 NEGATIVE POWER SUPPLY * .SUBCKT TS92X 1 2 3 4 5 * .MODEL MDTH D IS=1E-8 KF=2.664234E-16 CJO=10F * * INPUT STAGE CIP 2 5 1.000000E-12 CIN 1 5 1.000000E-12 EIP 10 5 2 5 1 EIN 16 5 1 5 1 RIP 10 11 8.125000E+00 RIN 15 16 8.125000E+00 RIS 11 15 2.
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TS922, TS922A macromodel TS922, TS922A R2N 19 5 1E+07 ************************** VINT1 500 0 5 GCONVP 500 501 119 4 19.38 VP 501 0 0 GCONVN 500 502 119 5 19.38 VN 502 0 0 ********* orientation isink isource ******* VINT2 503 0 5 FCOPY 503 504 VOUT 1 DCOPYP 504 505 MDTH 400E-9 VCOPYP 505 0 0 DCOPYN 506 504 MDTH 400E-9 VCOPYN 0 506 0 *************************** F2PP 19 5 poly(2) VCOPYP VP 0 0 0 0 0.5 F2PN 19 5 poly(2) VCOPYP VN 0 0 0 0 0.5 F2NP 19 5 poly(2) VCOPYN VP 0 0 0 0 1.
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TS922, TS922A 5 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.
PAGE 16
Package information 5.1 TS922, TS922A 8-bump Flip-chip package information Figure 14. 8-bump Flip-chip package dimensions (top view) 1. Die size: 1600 μm x 1600 μm ±30 μm Die height: 350 µm ±20 µm Die height (including bumps): 650 µm Bump diameter: 315 µm ±50 µm Bump height: 250 µm ±40 µm Pitch: 500 µm ±10 µm Backcoating Figure 15.
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TS922, TS922A Package information Figure 16. 8-bump Flip-chip marking (top view) (4) (1) (2) (3) GAMS0306131526CB 1. ST logo 2. Part number 3. Date code: Y = year, WW = week 4. This dot indicates the bump corner 1A Figure 17. 8-bump Flip-chip tape and reel specification (top view) 1 1 A A User direction of feed 1. Device orientation: the devices are oriented in the carrier pocket with bump number A1 adjacent to the sprocket holes.
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Package information 5.2 TS922, TS922A MiniSO8 package information Figure 18. MiniSO8 package mechanical drawing Table 6. MiniSO8 package mechanical data Dimensions Symbol Millimeters Min. Typ. A Max. Min. Typ. 1.1 A1 0 A2 0.75 b Max. 0.043 0.15 0 0.95 0.030 0.22 0.40 0.009 0.016 c 0.08 0.23 0.003 0.009 D 2.80 3.00 3.20 0.11 0.118 0.126 E 4.65 4.90 5.15 0.183 0.193 0.203 E1 2.80 3.00 3.10 0.11 0.118 0.122 e L 0.85 0.65 0.40 0.60 0.006 0.033 0.80 0.
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TS922, TS922A 5.3 Package information SO8 package information Figure 19. SO8 package mechanical drawing Table 7. SO8 package mechanical data Dimensions Symbol Millimeters Min. Typ. A Inches Max. Min. Typ. 1.75 0.069 A1 0.10 A2 1.25 b 0.28 0.48 0.011 0.019 c 0.17 0.23 0.007 0.010 D 4.80 4.90 5.00 0.189 0.193 0.197 E 5.80 6.00 6.20 0.228 0.236 0.244 E1 3.80 3.90 4.00 0.150 0.154 0.157 e 0.25 Max. 0.004 0.010 0.049 1.27 0.050 h 0.25 0.50 0.010 0.
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Package information 5.4 TS922, TS922A TSSOP8 package information Figure 20. TSSOP8 package mechanical drawing Table 8. TSSOP8 package mechanical data Dimensions Symbol Millimeters Min. Typ. A Max. Min. Typ. 1.20 A1 0.05 A2 0.80 b Max. 0.047 0.15 0.002 1.05 0.031 0.19 0.30 0.007 0.012 c 0.09 0.20 0.004 0.008 D 2.90 3.00 3.10 0.114 0.118 0.122 E 6.20 6.40 6.60 0.244 0.252 0.260 E1 4.30 4.40 4.50 0.169 0.173 0.177 e 0° L 0.45 aaa 1.00 0.
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TS922, TS922A 5.5 Package information DIP8 package information Figure 21. DIP8 package mechanical drawing Table 9. DIP8 package mechanical data Dimensions Symbol Millimeters Min. Typ. A Inches Max. Min. Typ. 5.33 Max. 0.210 A1 0.38 0.015 A2 2.92 3.30 4.95 0.115 0.130 0.195 b 0.36 0.46 0.56 0.014 0.018 0.022 b2 1.14 1.52 1.78 0.045 0.060 0.070 c 0.20 0.25 0.36 0.008 0.010 0.014 D 9.02 9.27 10.16 0.355 0.365 0.400 E 7.62 7.87 8.26 0.300 0.310 0.
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Ordering information 6 TS922, TS922A Ordering information Table 10.
PAGE 23
TS922, TS922A 7 Revision history Revision history Table 11. Document revision history Date Revision 01-Feb-2001 1 First release. 01-Jul-2004 2 Flip-chip package inserted in the document. 02-May-2005 3 Modifications in AMR Table 1 on page 4 (explanation of Vid and Vi limits, ESD MM and CDM values added, Rthja added). 01-Aug-2005 4 PPAP references inserted in the datasheet, see Table 6 on page 22. 01-Mar-2006 5 TS922EIJT part number inserted in the datasheet, see Table 6 on page 22.
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TS922, TS922A Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale.