Datasheet

Revision history TS4990
32/33 Doc ID 9309 Rev 13
7 Revision history
Table 12. Document revision history
Date Revision Changes
1-Jul-2002 1 First release.
4-Sep-2003 2 Update mechanical data.
1-Oct-2004 3 Order code for back coating on flip-chip.
2-Apr-2005 4 Typography error on page 1: Mini-SO-8 pin connection.
May-2005 5 New marking for assembly code plant.
1-Jul-2005 6 Error on Table 4 on page 5. Parameters in wrong column.
28-Sep-2005 7
Updated mechanical coplanarity data to 50µm (instead of 60µm) (see
Figure 67 on page 25).
14-Mar-2006 8 SO-8 package inserted in the datasheet.
21-Jul-2006 9 Update of Figure 66 on page 25. Disclaimer update.
11-May-2007 10
Corrected value of PSRR in Table 5 on page 6 from 1 to 61 (typical
value).
Moved Table 3: Component descriptions to Section 2: Typical application
schematics on page 4.
Merged daisy chain flip-chip order code table into Table 11: Order codes
on page 31.
17-Jan-2008 11
Corrected pitch error in DFN8 package information. Actual pitch is
0.5mm. Updated DFN8 package dimensions to correspond to JEDEC
databook definition (in previous versions of datasheet, package
dimensions were as in manufacturer’s drawing).
Corrected error in MiniSO-8 package information (L and L1 values were
inverted).
Reformatted package information.
21-May-2008 12
Corrected value of output resistance vs. ground in standby mode:
removed from Table 2 , and added in Ta bl e 4, Ta bl e 5, and Ta bl e 6.
30-Aug-2011 13
Updated DFN8 package (Figure 72)
Updated ECOPACK
®
text in Section 5: Package information