Datasheet

TS4990 Absolute maximum ratings and operating conditions
Doc ID 9309 Rev 13 3/33
1 Absolute maximum ratings and operating conditions
Table 1. Absolute maximum ratings (AMR)
Symbol Parameter Value Unit
V
CC
Supply voltage
(1)
6V
V
in
Input voltage
(2)
GND to V
CC
V
T
oper
Operating free-air temperature range -40 to + 85 °C
T
stg
Storage temperature -65 to +150 °C
T
j
Maximum junction temperature 150 °C
R
thja
Thermal resistance junction to ambient
Flip-chip
(3)
MiniSO-8
DFN8
250
215
120
°C/W
P
diss
Power dissipation Internally limited
ESD
HBM: Human body model
(4)
MM: Machine model
(5)
2
200
kV
V
Latch-up immunity 200 mA
Lead temperature (soldering, 10sec)
Lead temperature (soldering, 10sec) for lead-free version
250
260
°C
1. All voltage values are measured with respect to the ground pin.
2. The magnitude of the input signal must never exceed V
CC
+ 0.3 V / GND - 0.3 V.
3. The device is protected in case of over temperature by a thermal shutdown active at 150° C.
4. Human body model: A 100 pF capacitor is charged to the specified voltage, then discharged through a 1.5 kΩ resistor
between two pins of the device. This is done for all couples of connected pin combinations while the other pins are floating.
5. Machine model: A 200 pF capacitor is charged to the specified voltage, then discharged directly between two pins of the
device with no external series resistor (internal resistor < 5 Ω). This is done for all couples of connected pin combinations
while the other pins are floating.
Table 2. Operating conditions
Symbol Parameter Value Unit
V
CC
Supply voltage 2.2 to 5.5 V
V
icm
Common mode input voltage range 1.2V to V
CC
V
V
STBY
Standby voltage input:
Device ON
Device OFF
1.35 ≤ V
STBY
≤ V
CC
GND ≤ V
STBY
≤ 0.4
V
R
L
Load resistor ≥ 4 Ω
T
SD
Thermal shutdown temperature 150 °C
R
thja
Thermal resistance junction to ambient
Flip-chip
(1)
MiniSO-8
DFN8
(2)
100
190
40
°C/W
1. This thermal resistance is reached with a 100 mm
2
copper heatsink surface.
2. When mounted on a 4-layer PCB.