Datasheet

TS4990 Package information
Doc ID 9309 Rev 13 29/33
5.3 DFN8 package information
Note: DFN8 exposed pad (E2 x D2) is connected to pin number 7. For enhanced thermal
performance, the exposed pad must be soldered to a copper area on the PCB, acting as a
heatsink. This copper area can be electrically connected to pin7 or left floating.
Figure 72. DFN8 3x3x0.90mm package mechanical drawing (pitch 0.5mm)
Table 9. DFN8 3x3x0.90mm package mechanical data (pitch 0.5mm)
Ref.
Dimensions
Millimeters Mils
Min. Typ. Max. Min. Typ. Max.
A 0.80 0.90 1.00 31.5 35.4 39.4
A1 0.02 0.05 0.8 2.0
A2 0.55 0.65 0.80 217 25.6 31.5
A3 0.20 7.9
b 0.18 0.25 0.30 7.1 9.8 11.8
D 2.85 3.00 3.15 112.2 118.1 124
D2 2.20 2.70 86.6 106.3
E 2.85 3.00 3.15 112.2 118.1 124
E2 1.40 1.75 55.1 68.9
e 0.50 19.7
L 0.30 0.40 0.50 11.8 15.7 19.7
ddd 0.08 3.1
ddd
D
D2
E
A3
A
e
C
C
E2
PLANE
SEATING
BOTTOM VIEW
b
58
1
A2
A1
L
234
67
0.15x45°
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