Datasheet

TS4990 Package information
Doc ID 9309 Rev 13 27/33
Figure 69. TS4990 footprint recommendations
Figure 70. Tape and reel specification (top view)
Device orientation
The devices are oriented in the carrier pocket with pin number A1 adjacent to the sprocket
holes.
Pad in Cu 18μm with Flash NiAu (2-6μm, 0.2μm max.)
150μm min.
500μm
500μm
500μm
500μm
Φ=250μm
Φ=400μm typ.
75µm min.
100μm max.
Track
Non Solder mask opening
Φ=340μm min.
Pad in Cu 18μm with Flash NiAu (2-6μm, 0.2μm max.)
150μm min.
500μm
500μm
500μm
500μm
Φ=250μm
Φ=400μm typ.
75µm min.
100μm max.
Track
Non Solder mask opening
Φ=340μm min.
User direction of feed
A
1
A
1
8
Die size X + 70µm
Die size Y + 70µm
4
1.5
4
All dimensions are in mm
User direction of feed
A
1
A
1
A
1
A
1
8
Die size X + 70µm
Die size Y + 70µm
4
1.5
4
All dimensions are in mm