Datasheet

Package information TS4990
26/33 Doc ID 9309 Rev 13
Figure 67. Package mechanical data for 9-bump flip-chip package
Figure 68. Daisy chain mechanical data
The daisy chain sample features two-by-two pin connections. The schematics in Figure 68
illustrate the way pins connect to each other. This sample is used to test continuity on your
board. Your PCB needs to be designed the opposite way, so that pins that are unconnected
in the daisy chain sample, are connected on your PCB. If you do this, by simply connecting
an Ohmmeter between pin A1 and pin A3, the soldering process continuity can be tested.
■ Die size: 1.60 x 1.60 mm ±30µm
■ Die height (including bumps): 600µm
■ Bump diameter: 315µm ±50µm
■ Bump diameter before reflow: 300µm ±10µm
■ Bump height: 250µm ±40µm
■ Die height: 350µm ±20µm
■ Pitch: 500µm ±50µm
■ Coplanarity: 50µm max
■ * Back coating height: 100µm ±10µm
* Optional
1.60 mm
1.60 mm
0.5mm
0.5mm
∅ 0.25mm
1.60 mm
1.60 mm
0.5mm
0.5mm
∅ 0.25mm
600µm
100µm
600µm
100µm
A
C
B
1
2
3
1.6mm
1.6mm
A
C
B
1
2
3
1.6mm
1.6mm