Datasheet

TS4990 Package information
Doc ID 9309 Rev 13 25/33
5 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
5.1 Flip-chip package information
Figure 65. Flip-chip pinout (top view)
Figure 66. Marking (top view)
A
C
B
1
2
3
Vin- GND BYPASS
VOUT2
VCC
Vin+
VOUT1 GND
STBY
A
C
B
1
2
3
Vin- GND BYPASS
VOUT2
VCC
Vin+
VOUT1 GND
STBY
Vin- GND BYPASS
VOUT2
VCC
Vin+
VOUT1 GND
STBY
■ Balls are underneath
XXX
YWW
E
XXX
YWW
E
■ ST logo
■ Product and assembly code: XXX
A90 from Tours
90S from Shenzhen
■ Three-digit datecode: YWW
■ E symbol for lead-free only
■ The dot indicates pin A1
Symbol for
lead-free package