Datasheet

TS4962 Package information
Doc ID 10968 Rev 8 41/44
Figure 71. DFN8 3 x 3 exposed pad package mechanical drawing (pitch 0.65 mm)
Table 12. DFN8 3 x 3 exposed pad package mechanical data (pitch 0.65 mm)
Note: 1 The pin 1 identifier must be visible on the top surface of the package by using an indentation
mark or other feature of the package body. Exact shape and size of this feature are optional.
2 The dimension L does not conform with JEDEC MO-248, which recommends
0.40+/-0.10 mm.
For enhanced thermal performance, the exposed pad must be soldered to a copper area on
the PCB, acting as a heatsink. This copper area can be electrically connected to pin 7 or left
floating.
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 0.50 0.60 0.65 0.020 0.024 0.026
A1 0.02 0.05 0.0008 0.002
A3 0.22 0.009
b 0.25 0.30 0.35 0.010 0.012 0.014
D 2.85 3.00 3.15 0.112 0.118 0.124
D2 1.60 1.70 1.80 0.063 0.067 0.071
E 2.85 3.00 3.15 0.112 0.118 0.124
E2 1.10 1.20 1.30 0.043 0.047 0.051
e 0.65 0.026
L 0.50 0.55 0.60 0.020 0.022 0.024
ddd 0.08 0.003