Datasheet

ManualsBrandsSTMICROELECTRONICS ManualsLinear ICsLinear IC - Comparator Differential CMOS, MOS, Open drain, TTL SO 8

April 2011 Doc ID 4068 Rev 2 1/10

TS372

Low power dual CMOS voltage comparator

Features

■ Wide single supply range or dual supplies 3 V

to 16 V or ±1.5 V to ±8 V

■ Very low supply current: 0.1 mA/comparator

independent of supply voltage

■ Extremely low input bias current: 1 pA typ

■ Extremely low input offset currents: 1 pA typ

■ Low input offset voltage

■ Input common-mode voltage range includes

GND

■ Low output saturation voltage 150 mV typical

■ Output compatible with TTL, MOS and CMOS

■ High input impedance: 10

Ω typical

■ Fast response time: 200 ns typ for TTL level

input step

Applications

■ Battery powered electronics

■ General-purpose portable device

■ General-purpose low voltage application

Description

These devices consist of two independent

precision voltage comparators, designed to

operate with single or dual supplies.

These differential comparators use the

STMicroelectronics silicon lin MOS process giving

them an excellent consumption-speed ratio.

These devices are ideally suited for low

consumption applications.

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DIP8

(plastic package)

SO8

(plastic micropackage)

Pin connections (top view)

www.st.com

Summary of content (10 pages)

PAGE 1
TS372 Low power dual CMOS voltage comparator Features ■ Wide single supply range or dual supplies 3 V to 16 V or ±1.5 V to ±8 V ■ Very low supply current: 0.
PAGE 2
Application schematic TS372 1 Application schematic Figure 1.
PAGE 3
TS372 2 Absolute maximum ratings and operating conditions Absolute maximum ratings and operating conditions Table 1.
PAGE 4
Electrical characteristics 3 TS372 Electrical characteristics Table 3. Symbol Vio Electrical characteristics at VCC+ = 5 V, VCC- = 0 V, Tamb = 25°C (unless otherwise specified) Parameter Min. Input offset voltage (Vic = Vicm min) (1) Tamb = 25°C Tmin ≤Tamb ≤Tmax Typ. Max.
PAGE 5
TS372 4 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.
PAGE 6
Package information 4.1 TS372 DIP8 package information Figure 2. DIP8 package mechanical drawing Table 5. DIP8 package mechanical data Dimensions Ref. Millimeters Min. Typ. A Max. Min. Typ. 5.33 Max. 0.210 A1 0.38 0.015 A2 2.92 3.30 4.95 0.115 0.130 0.195 b 0.36 0.46 0.56 0.014 0.018 0.022 b2 1.14 1.52 1.78 0.045 0.060 0.070 c 0.20 0.25 0.36 0.008 0.010 0.014 D 9.02 9.27 10.16 0.355 0.365 0.400 E 7.62 7.87 8.26 0.300 0.310 0.325 E1 6.10 6.35 7.
PAGE 7
TS372 4.2 Package information SO-8 package information Figure 3. SO-8 package mechanical drawing Table 6. SO-8 package mechanical data Dimensions Ref. Millimeters Min. Typ. A Inches Max. Min. Typ. 1.75 0.069 A1 0.10 A2 1.25 b 0.28 0.48 0.011 0.019 c 0.17 0.23 0.007 0.010 D 4.80 4.90 5.00 0.189 0.193 0.197 E 5.80 6.00 6.20 0.228 0.236 0.244 E1 3.80 3.90 4.00 0.150 0.154 0.157 e 0.25 Max. 0.004 0.010 0.049 1.27 0.050 h 0.25 0.50 0.010 0.020 L 0.
PAGE 8
Ordering information 5 Ordering information Table 7.
PAGE 9
TS372 6 Revision history Revision history Table 8. Document revision history Date Revision Changes 01-Feb-2002 1 Initial release. 28-Apr-2011 2 Document reformatted. Modified Table 2, Table 3 and Table 7.
PAGE 10
TS372 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale.