Datasheet
Table Of Contents
- Figure 1. Functional diagram
- 1 Characteristics
- Table 1. Absolute ratings (Tamb = 25 C)
- Table 2. Thermal resistances
- Table 3. Electrical characteristics (Tamb = 25 C)
- Figure 2.
- Table 4. Capacitance characteristics
- Figure 3. Pulse waveform (10/1000 µs)
- Figure 4. Surge peak current versus overload duration
- Figure 5. Reference test circuit 1
- Figure 6. Functional holding current (IH) test circuit 2
- 2 Application information
- 3 Ordering information scheme
- 4 Package information
- 5 Ordering Information
- 6 Revision history

Characteristics TPI
2/9
1 Characteristics
Figure 2.
Table 1. Absolute ratings (T
amb
= 25 °C)
Symbol Parameter Value Unit
I
PP
Peak pulse current (see note
(1)
)
1. See Figure 3.
10/1000 µs
5/310 µs
2/10 µs
30
40
90
A
I
TSM
Non repetitive surge peak on-state current (F = 50 Hz)
t
p
= 10 ms
t = 1s
8
3.5
A
T
stg
T
j
Storage temperature range
Maximum junction temperature
- 55 to 150
150
°C
T
L
Maximum lead temperature for soldering during 10 s. 260 °C
Table 2. Thermal resistances
Symbol Parameter Value Unit
R
th(j-a)
Junction to ambient 170 °C/W
Table 3. Electrical characteristics (T
amb
= 25 °C)
Symbol Parameter
V
RM
Stand-off voltage
V
BR
Breakdown voltage
V
BO
Breakover voltage
I
RM
Leakage current
I
PP
Peak pulse current
I
BO
Breakover current
I
H
Holding current
V
F
Forward voltage drop
C Capacitance
Order code
I
RM
@ V
RM
V
BR
@ I
R
V
BO
V
BO
dyn.
I
BO
I
H
max. min. max.
note
(1)
1. See the reference test circuit 1 (Figure 5.)
typ.
note
(2)
2. Surge test according to CCITT 1.5 kV, 10/700 µs between Tip or Ring and ground
max.
note
(1)
min.
note
(3)
3. See functional holding current test circuit 2 (Figure 6.)
µA V V mA V V mA mA
TPI8011N 10 70 80 1 110 120 800 150
TPI12011N 10 105 120 1 160 170 800 150