Datasheet

Characteristics P010xx
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Table 6. Thermal resistance
Symbol Parameter Maximum Unit
R
th(j-a)
Junction to case (DC) TO-92 80 °C/W
R
th(j-t)
Junction to tab (DC) SOT-223 30 °C/W
R
th(j-a)
Junction to ambient (DC)
TO-92 150
°C/W
S
(1)
= 5 cm
2
SOT-223 60
R
th(j-a)
Junction to ambient (mounted on FR4 with recommended pad layout) SOT23-3L 400 °C/W
1. S = Copper surface under tab.
Figure 1. Maximum average power
dissipation vs. average on-state
current P010xxA and P010xxN
Figure 2. Maximum average power
dissipation vs. average on-state
current P010xxL
0
.
00
.1
0
.2
0
.
30
.4
0
.
50
.
6
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
P(W)
α = 180°
360°
α
I (A)
T(AV)
0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16 0.18
0.00
0.02
0.04
0.06
0.08
0.10
0.12
0.14
0.16
0.18
0.20
0.22
0.24
0.26
0.28
0.30
P(W)
I (A)
T(AV)
α
= 180°
360°
α
Figure 3. Average and DC on-state current
vs. lead temperature
P010xxA and P010xxN
Figure 4. Average and DC on-state current
vs. ambient temperature P010xxA
and P010xxN
0 25 50 75 100 125
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
I (A)
T(AV)
T (°C)
lead
α
= 180° (SOT-223)
α
= 180° (TO-92)
D.C. (SOT-223)
D.C. (TO-92)
0 25 50 75 100 125
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
I (A)
T(AV)
T (°C)
amb
α
= 180° (SOT-223)
α
= 180° (TO-92)
D.C. (SOT-223)
D.C. (TO-92)
Device mounted on
FR4 with recomended
pad layout for SOT-223