Datasheet

ManualsBrandsSTMICROELECTRONICS ManualsLinear ICsLinear IC - Audio amplifier 1-channel (mono) Class AB SO 8

1/8

TDA7233

May 2010

1 FEATURES

 OPERATING VOLTAGE 1.8 TO 15 V

 EXTERNAL MUTE OR POWER DOWN

FUNCTION

 IMPROVED SUPPLY VOLTAGE REJECTION

 LOW QUIESCENT CURRENT

 HIGH POWER CAPABILITY

 LOW CROSSOVER DISTORTION

2 DESCRIPTION

The TDA7233/D is a monolithic integrated circuit

in 8 pin Minidip or SO8 package, intended for use

as class AB power amplifier with a wide range of

supply voltage from 1.8V to 15V in portable play-

ers, cordless telephones and Cellular Radios.

1W AUDIO AMPLIFIER WITH MUTE

Figure 2. Pin Connection

REV. 4

gure 1.

age

Table 1. Order Codes

Part Number Package

TDA7233 Minidip

TDA7233D SO8

Minidip

SO8

Summary of content (8 pages)

PAGE 1
TDA7233 1W AUDIO AMPLIFIER WITH MUTE 1 FEATURES OPERATING VOLTAGE 1.8 TO 15 V EXTERNAL MUTE OR POWER DOWN FUNCTION IMPROVED SUPPLY VOLTAGE REJECTION LOW QUIESCENT CURRENT HIGH POWER CAPABILITY LOW CROSSOVER DISTORTION 2 DESCRIPTION The TDA7233/D is a monolithic integrated circuit in 8 pin Minidip or SO8 package, intended for use as class AB power amplifier with a wide range of supply voltage from 1.8V to 15V in portable players, cordless telephones and Cellular Radios. Figure 1.
PAGE 2
TDA7233 Table 2. Absolute Maximum Ratings Symbol Parameter Value Unit VS Supply Voltage 16 V Ptot Total Power Dissipation at Tamb = 50 °C 1 W IO Tstg, Tj Output Peak Current Storage and Junction Temperature 1 A -40 to 150 °C Figure 3. PIN CONNECTIONS (top view) Minidip SO8 Table 3. Thermal Data Symbol Rth j-amb Parameter Thermal Resistance Junction-ambient Max. SO8 MInidip Unit 200 100 °C/W Table 4.
PAGE 3
TDA7233 Figure 4. Output Power versus Supply Voltage Figure 5. Supply Voltage Rejection versus Frequency Figure 7. Quiescent Current versus Supply Voltage Figure 8. Total Power Dissipated versus Supply Voltage Figure 6.
PAGE 4
TDA7233 3 PACKAGE MECHANICAL DATA In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.
PAGE 5
TDA7233 Figure 9. Minidip Mechanical Data & Package Dimensions mm inch DIM. MIN. A TYP. MAX. MIN. 3.32 TYP. MAX. 0.131 a1 0.51 B 1.15 1.65 0.045 0.065 b 0.356 0.55 0.014 0.022 b1 0.204 0.304 0.008 0.012 0.020 D E 10.92 7.95 9.75 0.430 0.313 0.384 e 2.54 0.100 e3 7.62 0.300 e4 7.62 0.300 F 6.6 0.260 I 5.08 0.200 L Z 3.18 OUTLINE AND MECHANICAL DATA 3.81 1.52 0.125 0.150 Minidip 0.
PAGE 6
TDA7233 Figure 10. SO8 Mechanical Data & Package Dimensions mm inch DIM. MIN. TYP. A A1 0.100 MAX. MIN. TYP. MAX. 1.750 0.0689 0.250 0.0039 0.0098 A2 1.250 0.0492 b 0.280 0.480 0.0110 0.0189 c 0.170 0.230 0.0067 0.0091 D (1) 4.800 4.900 5.000 0.1890 0.1929 0.1969 E 5.800 6.000 6.200 0.2283 0.2362 0.2441 3.800 3.900 4.000 0.1496 0.1535 0.1575 (2) E1 e 1.270 0.0500 h 0.250 0.500 0.0098 0.0197 L 0.400 1.270 0.0157 0.0500 L1 k ccc 1.
PAGE 7
TDA7233 4 REVISION HISTORY Table 5.
PAGE 8
TDA7233 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale.