Datasheet

Package information STTH8R06
12/17 DocID7688 Rev 7
Devices in I
2
PAK with nickel-plated back frame must NOT be mounted by frame soldering
like SMDs. Such devices are intended to be through-hole mounted ONLY and in no
circumstances shall ST be held liable for any lack of performance or damage arising out of
soldering of nickel-plated back frames.
Figure 17. I
2
PAK dimension definitions
E
L2
L1
b1
D
A1
c
c2
A
b
e
e1
L