Datasheet

STTH8L06 Characteristics
Doc ID 8373 Rev 6 5/11
Figure 13. Thermal resistance junction to ambient versus copper surface under tab (D
2
PAK )
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70
0 5 10 15 20 25 30 35 40
S(Cu)(cm²)
R (°C/W)
th(j-a)
epoxy FR4, Cu = 35 µm