Datasheet
Table Of Contents
- Table 1. Device summary
- 1 Characteristics
- Table 2. Absolute maximum ratings (Tamb = 25 °C)
- Table 3. Thermal resistances
- Figure 1. Electrical characteristics - definitions
- Table 4. Electrical characteristics - values
- Figure 2. Clamping voltage versus peak pulse current - STRVS118X02C (typical values)
- Figure 3. Clamping voltage versus peak pulse current - STRVS142X02F (typical values)
- Figure 4. Clamping voltage versus peak pulse current - STRVS182X02F (typical values)
- Figure 5. Clamping voltage versus peak pulse current - STRVS185X02B/E (typical values)
- Figure 6. Clamping voltage versus peak pulse current - STRVS222X02F (typical values)
- Figure 7. Clamping voltage versus peak pulse current - STRVS225X02E (typical values)
- Figure 8. Clamping voltage versus peak pulse current - STRVS241X02E (typical values)
- Figure 9. Clamping voltage versus peak pulse current - STRVS248X02C (typical values)
- Figure 10. Clamping voltage versus peak pulse current - STRVS252X02F
- Figure 11. Clamping voltage versus peak pulse current - STRVS280X02F
- Figure 12. Leakage current versus junction temperature (typical values) STRVSxxxC
- Figure 13. Leakage current versus junction temperature (typical values) STRVSxxxF
- Figure 14. Leakage current versus junction temperature (typical values) STRVSxxxB
- Figure 15. Leakage current versus junction temperature (typical values) STRVSxxxE
- Figure 16. Thermal resistance junction to ambient versus copper surface of connections - SMB
- Figure 17. Thermal resistance junction to ambient versus copper surface of connections - SMC
- Figure 18. Thermal resistance junction to ambient versus copper surface of connections - DO-15
- Figure 19. Thermal resistance junction to ambient versus copper surface of connections - DO-201
- 2 Package information
- Figure 20. SMB dimension definitions
- Table 5. SMB dimension values
- Figure 21. SMB Footprint, dimensions in mm (inches)
- Figure 22. SMB marking layout
- Figure 23. SMC dimension definitions
- Table 6. SMC dimension values
- Figure 24. SMC footprint, dimensions in mm (inches)
- Figure 25. SMC marking layout
- Figure 26. DO-15 dimension definitions
- Table 7. DO-15 dimension values
- Figure 27. DO-201 dimension definitions
- Table 8. DO-201 dimension values
- 3 Ordering information
- 4 Revision history
Characteristics STRVSX
6/13 DocID023950 Rev 3
Figure 14. Leakage current versus junction
temperature (typical values) STRVSxxxB
Figure 15. Leakage current versus junction
temperature (typical values) STRVSxxxE
0,1
1
10
100
1000
10000
25 50 75 100 125 150
V
R
=V
RM
I
R
(nA)
T
j
(°C)
0,1
1
10
100
1000
10000
25 50 75 100 125 150 175
V
R
=V
RM
I
R
(nA)
T
j
(°C)
Figure 16. Thermal resistance junction to
ambient versus copper surface of connections -
SMB
Figure 17. Thermal resistance junction to
ambient versus copper surface of connections -
SMC
0
20
40
60
80
100
120
140
160
180
200
012345678910
R
th(j-a)
(°C/W)
Copper surface (cm
2
)
0
20
40
60
80
100
120
140
160
180
200
012345678910
R
th(j-a)
(°C/W)
Copper surface (cm
2
)
Figure 18. Thermal resistance junction to
ambient versus copper surface of connections -
DO-15
Figure 19. Thermal resistance junction to
ambient versus copper surface of connections -
DO-201
0
50
100
150
012345
R
th(j-a)
(°C/W)
Copper surface (cm
2
)
0
50
100
150
012345
R
th(j-a)
(°C/W)
Copper surface (cm
2
)