Datasheet
Table Of Contents
- Table 1. Device summary
- 1 Characteristics
- Table 2. Absolute ratings (limiting values)
- Table 3. Thermal resistance
- Table 4. Static electrical characteristics (per diode)
- Figure 1. Average forward power dissipation versus average forward current
- Figure 2. Normalized avalanche power derating versus pulse duration
- Figure 3. Average forward current versus ambient temperature, d = 0.5, (TO-220AC, D2PAK)
- Figure 4. Average forward current versus ambient temperature, d = 0.5, (TO-220FPAC)
- Figure 5. Non repetitive surge peak forward current versus overload duration - maximum values, per diode (TO-220AC, D2PAK)
- Figure 6. Non repetitive surge peak forward current versus overload duration - maximum values (TO-220FPAC)
- Figure 7. Relative variation of thermal impedance junction to case versus pulse duration (TO-220AC, D2PAK)
- Figure 8. Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAC)
- Figure 9. Reverse leakage current versus reverse voltage applied (typical values)
- Figure 10. Junction capacitance versus reverse voltage applied (typical values)
- Figure 11. Forward voltage drop versus forward current (maximum values)
- Figure 12. Thermal resistance junction to ambient versus copper surface under tab (D²PAK)
- 2 Package Information
- 3 Ordering Information
- 4 Revision history

Package Information STPS8H100
8/10 DocID5387 Rev 11
Figure 16. TO-220FPAC dimension definitions
Table 7. TO-220FPAC dimension values
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A 4.4 4.6 0.173 0.181
B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.45 0.70 0.018 0.027
F 0.75 1 0.030 0.039
F1 1.15 1.70 0.045 0.067
G 4.95 5.20 0.195 0.205
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409
L2 16 Typ. 0.63 Typ.
L3 28.6 30.6 1.126 1.205
L4 9.8 10.6 0.386 0.417
L5 2.9 3.6 0.114 0.142
L6 15.9 16.4 0.626 0.646
L7 9.00 9.30 0.354 0.366
Dia. 3.00 3.20 0.118 0.126
H
A
B
Dia
L7
L6
L5
F1
F
D
E
L4
G1
G
L2
L3