Datasheet

STPS340U/S/B
4/7
12 51020 50
10
20
50
100
200
500
VR(V)
C(pF)
F=1MHz
Tj=25°C
Fig. 8: Junction capacitance versus reverse
voltage applied (Typical values).
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
0.01
0.10
1.00
10.00
IFM(A)
Typical values
Tj=150°C
Tj=125°C
VFM(V)
Fig. 9: Forward voltage drop versus forward
current (Maximum values).
0 5 10 15 20 25 30 35 40
1E-5
1E-4
1E-3
1E-2
VR(V)
IR(A)
Tj=125°C
Tj=100°C
Tj=75°C
Tj=150°C
Fig. 7: Reverse leakage current versus reverse
voltage applied (Typical values).
012345
0
20
40
60
80
100
120
S(Cu) (cm²)
Rth(j-a) (°C/W)
Fig. 10-1: Thermal resistance junction to ambient
versus copper surface under each lead (Epoxy printed
circuit board FR4, copper thickness: 35µm) (SMB).
012345
0
20
40
60
80
100
Rth(j-a) (°C/W)
S(Cu) (cm²)
Fig. 10-2: Thermal resistance junction to ambient
versus copper surface under each lead (Epoxy printed
circuit board FR4, copper thickness: 35µm) (SMC).
02468101214161820
0
20
40
60
80
100
Rth(j-a) (°C/W)
S(Cu) (cm²)
Fig. 10-3: Thermal resistance junction to ambient
versus copper surface under each lead (Epoxy printed
circuit board FR4, copper thickness: 35µm) (DPAK).