Datasheet

STPS340U/S/B
3/7
1E-3 1E-2 1E-1 1E+0
0
1
2
3
4
5
6
7
8
9
10
t(s)
IM(A)
Ta=25°C
Ta=50°C
Ta=100°C
IM
t
δ=0.5
Fig. 5-1: Non repetitive surge peak forward current
versus overload duration (SMB)(Maximum values).
1.0E-2 1.0E-1 1.0E+0 1.0E+1 1.0E+2 1.0E+3
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
tp(s)
Zth(j-a)/Rth(j-a)
Printed circuit board (e=35µm)
T
δ
=tp/T
tp
Single pulse
δ = 0.1
δ = 0.2
δ = 0.5
Fig. 6-1: Relative variation of thermal transient
impedance junction to lead versus pulse duration
(SMB).
1E-3 1E-2 1E-1 1E+0
0
2
4
6
8
10
12
Ta=25°C
Ta=50°C
Ta=100°C
t(s)
IM(A)
IM
t
δ=0.5
Fig. 5-2: Non repetitive surge peak forward current
versus overload duration (SMC) (Maximum values).
1E-3 1E-2 1E-1 1E+0
0
10
20
30
40
50
Tc=25°C
Tc=50°C
Tc=100°C
t(s)
IM(A)
IM
t
δ=0.5
Fig. 5-3: Non repetitive surge peak forward current
versus overload duration (DPAK) (Maximum
values).
1.0E-2 1.0E-1 1.0E+0 1.0E+1 1.0E+2 1.0E+3
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
tp(s)
Zth(j-a)/Rth(j-a)
T
δ
=tp/T
tp
Printed circuit board (e=35µm)
Single pulse
δ = 0.1
δ = 0.2
δ = 0.5
Fig. 6-2: Relative variation of thermal transient
impedance junction to lead versus pulse duration
(SMC).
1E-3 1E-2 1E-1 1E+0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
tp(s)
Zth(j-a)/Rth(j-a)
T
δ
=tp/T
tp
Printed circuit board (e=35µm)
Single pulse
δ = 0.1
δ = 0.2
δ = 0.5
Fig. 6-3: Relative variation of thermal transient
impedance junction to lead versus pulse
duration(DPAK).