Datasheet

STPS30L45C Characteristics
Doc ID 8002 Rev 4 5/12
Figure 11. Forward voltage drop versus
forward current (maximum values,
per diode)
Figure 12. Thermal resistance junction to
ambient versus copper surface
under tab for D
2
PAK
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
1
10
100
200
VFM(V)
IFM(A)
Typical values
Tj=150°C
Tj=25°C
Tj=125°C
0 5 10 15 20 25 30 35 40
0
10
20
30
40
50
60
70
80
S(cm²)
Rth(j-a) (°C/W)
Epoxy printed circuit board FP4,
copper thickness = 35 µm