Datasheet

STP36NF06 STP36NF06FP
2/9
THERMAL DATA
ELECTRICAL CHARACTERISTICS (T
case
= 25 °C unless otherwise specified)
OFF
ON
(*)
DYNAMIC
TO-220 TO-220FP
Rthj-case Thermal Resistance Junction-case Max 2.14 6 °C/W
Rthj-amb
T
l
Thermal Resistance Junction-ambient
Maximum Lead Temperature For Soldering Purpose
(1.6 mm from case, for 10 sec)
Max
62.5
300
°C/W
°C
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
Drain-source
Breakdown Voltage
I
D
= 250 µA, V
GS
= 0
60 V
I
DSS
Zero Gate Voltage
Drain Current (V
GS
= 0)
V
DS
= Max Rating
V
DS
= Max Rating T
C
= 125°C
1
10
µA
µA
I
GSS
Gate-body Leakage
Current (V
DS
= 0)
V
GS
= ± 20 V
±100 nA
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
GS(th)
Gate Threshold Voltage
V
DS
= V
GS
I
D
= 250 µA
2V
R
DS(on)
Static Drain-source On
Resistance
V
GS
= 10 V I
D
= 15 A
0.032 0.040
Ω
Symbol Parameter Test Conditions Min. Typ. Max. Unit
g
fs
(*)
Forward Transconductance
V
DS
= 25 V I
D
= 15 A
12 S
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
V
DS
= 25V f = 1 MHz V
GS
= 0
690
170
68
pF
pF
pF