Datasheet

STP16DP05 Typical characteristics
Doc ID 13093 Rev 6 15/31
Figure 14. Power dissipation vs temperature package
Note: The exposed pad should be soldered to the PBC to realize the thermal benefits.
Figure 13. I
DD
ON\OFF
0
2
4
6
8
10
12
14
0 102030405060708090
Iset (mA )
Idd (mA)
IddON Avg @ 5.5V
IddON Avg @ 3.6V
IddOFF Avg @ 5.5V
IddOFF Avg @ 3.6V