Typical characteristics STP08CP05
16/31 DocID13524 Rev 6
Figure 13. Power dissipation vs temperature package
Note: The exposed-pad should be soldered to the PBC to realize the thermal benefits.
Figure 14. Current precision between outputs vs output current
0
0.5
1
1.5
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2.5
3
3.5
4
4.5
5
5.5
6
110100
Iset (mA)
%
