Datasheet

inches
(1)
mmDim.
MaxTypMinMaxTypMin
0.41930.393710.65010.000H
0.02950.00980.7500.250h
0.05000.01571.2700.400L
8.0°0.0°8.0°0.0°k
0.00390.100ddd
(1)
Values in inches are converted from mm and rounded to 4 decimal digits
Thermal characteristics11.8
The maximum chip junction temperature (T
J max
) must never exceed the values given in
Operating conditions.
The maximum chip-junction temperature, T
Jmax
, in degrees Celsius, may be calculated using
the following equation:
T
Jmax
= T
Amax
+ (P
Dmax
x Θ
JA
)
Where:
•
T
Amax
is the maximum ambient temperature in °C
•
Θ
JA
is the package junction-to-ambient thermal resistance in °C/W
•
P
Dmax
is the sum of P
INTmax
and P
I/Omax
(PDmax = P
INTmax
+ P
I/Omax
)
•
P
INTmax
is the product of I
DD
andV
DD
, expressed in Watts. This is the maximum chip internal
power.
•
P
I/Omax
represents the maximum power dissipation on output pins
Where:
P
I/Omax
=Σ (V
OL
*I
OL
) + Σ((V
DD
-V
OH)
*I
OH
), taking into account the actual V
OL
/I
OL and
V
OH
/I
OH
of the I/Os at low and high level in the application.
Table 60: Thermal characteristics
UnitValueParameter
(1)
Symbol
°C/W
110
Thermal resistance junction-ambient
TSSOP20 - 4 x 4 mm
Θ
JA
°C/W
20
Thermal resistance junction-ambient
SO20W - 300 mils
Θ
JA
DocID15590 Rev 8102/116
STM8S903K3 STM8S903F3Package information