Datasheet

32-lead UFQFPN package mechanical data11.4
Figure 50: 32-lead, ultra thin, fine pitch quad flat no-lead package (5 x 5)
AOB8_ME
1. Drawing is not to scale.
2. All leads/pads should be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended
to connect and solder this backside pad to PCB ground.
4. Dimensions are in millimeters.
Table 55: 32-lead, ultra thin, fine pitch quad flat no-lead package mechanical data
inches
(1)
mmDim.
MaxTypMinMaxTypMin
0.02360.02170.01970.6000.5500.500A
0.00200.00080.0500.0200A1
0.00790.200A3
0.01180.00980.00710.3000.2500.180b
DocID14771 Rev 12108/124
STM8S105xxPackage information