Datasheet

32-lead UFQFPN package mechanical data11.2
Figure 46: 32-lead, ultra thin, fine pitch quad flat no-lead package (5 x 5)
AOB8_ME
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint
life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended
to connect and solder this backside pad to PCB ground.
4. Dimensions are in millimeters.
Table 53: 32-lead, ultra thin, fine pitch quad flat no-lead package mechanical data
inches
(1)
mmDim.
MaxTypMinMaxTypMin
0.02360.02170.01970.6000.5500.500A
0.00200.00080.0500.0200A1
0.00790.200A3
DocID15441 Rev 996/117
STM8S103K3 STM8S103F3 STM8S103F2Package information