Datasheet

Figure 48. 32-lead shrink plastic DIP (400 ml) package ........................................................................98
Figure 49. 20-pin, 4.40 mm body, 0.65 mm pitch .................................................................................101
Figure 50. 20-lead, plastic small outline (300 mils) package ...............................................................101
Figure 51. Recommended footprint for on-board emulation ................................................................102
Figure 52. Recommended footprint without on-board emulation .........................................................103
Figure 53. STM8S103x access line ordering information scheme ......................................................106
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List of figuresSTM8S103K3 STM8S103F3 STM8S103F2