Datasheet

ChangesRevisionDate
Updated maximum power dissipation in Table 19: General
operating conditions.
Updated Θ
JA
in Table 58: Thermal characteristics.
Replaced package pitch digit by VFQFPN/UFQFPN package
digit in Figure 53: STM8S103x access line ordering information
scheme, and removed note 1.
Removed VFQFPN32 package.
609-Sep-2010
Removed internal reference voltage from Analog-to-digital
converter (ADC1).
Updated "reset state" of Table 4: Legend/abbreviations for
pinout tables in Pinout and pin description.
Added footnote to PD1/SWIM pin in STM8S103Kx
UFQFPN32/LQFP32/SDIP32 pinout and pin description.
Updated pins 14 and 19 (TSSOP20/SO20) / pins 11 and 16
(UFQFPN20) in STM8S103Fx TSSOP20/SO20/UFQFPN20
pin description.
General hardware register map : Standardized all reset state
values; updated the reset state values of the RST_SR,
CLK_SWCR, CLK_HSITRIMR, CLK_SWIMCCR, IWDG_KR,
and ADC_DRx registers in the "General hardware register
map" table.
Updated AFR2 description of OPT 2 in Table 14: STM8S103F
alternate function remapping bits for 20-pin devices.
Replaced 0.01 µF with 0.1 µf in Figure 38: Recommended
reset pin protection.
Added "Typical application with I
2
C bus and timing diagram in
I2C interface characteristics.
Updated footnote 1 in Table 46: ADC accuracy with RAIN <
10 kΩ , VDD= 5 V and Table 47: ADC accuracy with RAIN <
10 kΩ RAIN, VDD = 3.3 V .
STM8S103 FASTROM microcontroller option list: updated
"special marking" section and AFR2 description of OPT2
alternate function remapping for STM8S103F.
32-lead UFQFPN package mechanical data: updated existing
footnote and added three additional footnotes.
Updated note related to true open-drain outputs in Table 6:
STM8S103Fx pin description.
712-Jul-2011
Remove CLK_CANCCR register from Table 8: General
hardware register map
115/117DocID15441 Rev 9
Revision historySTM8S103K3 STM8S103F3 STM8S103F2