Datasheet

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STM8L151xx, STM8L152xx Revision history
130
12 Revision history
Table 69. Document revision history
Date Revision Changes
06-Aug-2009 1 Initial release
10-Sep-2009 2
Updated peripheral naming throughout document.
Added Figure 3: STM8L151Cx 48-pin pinout (without LCD) on
page 30
Added capacitive sensing channels in Features on page 1
Updated PA7, PC0 and PC1 in Table 7: Medium density STM8L15x
pin description
Changed CLK and REMAP register names in Table 13
Changed description of WDGHALT in Tab le 12
Added typical power consumption values in Ta ble 18 to Table 26
Correct VIH max in Table 37
11-Dec-2009 3
Added WLCSP28 package
Modified Figure 9: Memory map on page 37 and added 2 notes.
Modified Low power run mode in Section 3.1: Low power modes on
page 16
Added Section 8: Unique ID on page 61
Modified Table 11: Interrupt mapping on page 56 (added reserved
area at address 0x00 8008)
Modified OPT4 option bits in Table 11: Option byte addresses on
page 49
Table 12: Option byte description on page 50: modified OPT0
description (“disable” instead of “enable”) and OPT1 description
Added OPTBL option bytes
Modified Section 9: Electrical parameters on page 53
02-Apr-2010 4
Changed title of the document (STM8L151x4, STM8L151x6,
STM8L152x4, STM8L152x6)
Changed pinout (V
SS1
, V
DD1
, V
SS2
, V
DD 2
instead of V
SS
, V
DD,
V
SSIO
, V
DDIO
Changed packages
Changed first page
Modified note 1 in Table 7: Medium density STM8L15x pin
description on page 37
Added note to PA7, PC0, PC1 and PE0 in Table 7: Medium density
STM8L15x pin description on page 37
Modified Figure 9: Memory map on page 37
Modified Table 68: WLCSP28 – 28-pin wafer level chip scale
package, package mechanical data on page 121 (min and max
columns swapped)
Modified Figure 51: WLCSP28 – 28-pin wafer level chip scale
package, package outline on page 121 (A1 ball location)
Section : on page 69: renamed Rm, Lm and Cm
EXTI_CONF replaced with EXTI_CONF1 in Table 13: General
hardware register map on page 51
Updated Section 9: Electrical parameters on page 53