Datasheet

Package characteristics STM8L151xx, STM8L152xx
116/131 DocID15962 Rev 13
10.2.2 48-pin ultra thin fine pitch quad flat no-lead 7 x 7 mm, 0.5 mm pitch
package (UFQFPN48)
Figure 45. UFQFPN48 package outline
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and
solder this back-side pad to PCB ground.
A0B9_ME_V3
D
Pin 1 indentifier
laser marking area
EE
D
Y
D2
E2
Exposed pad
area
Z
1
48
Detail Z
R 0.125 typ.
1
48
L
C 0.500x45°
pin1 corner
A
Seating
plane
A1
b
e
ddd
Detail Y
T