Datasheet

Electrical parameters STM8L151xx, STM8L152xx
70/131 DocID15962 Rev 13
I
DD(Wait)
Supply
current in
Wait
mode
CPU not
clocked,
all peripherals
OFF,
code executed
from Flash,
V
DD
from
1.65 V to 3.6 V
HSI
f
CPU
= 125 kHz
0.38 0.48 0.49 0.50 0.56
mA
f
CPU
= 1 MHz
0.41 0.49 0.51 0.53 0.59
f
CPU
= 4 MHz
0.50 0.57 0.58 0.62 0.66
f
CPU
= 8 MHz
0.60 0.66 0.68 0.72 0.74
f
CPU
= 16 MHz
0.79 0.84 0.86 0.87 0.90
HSE
(6)
external
clock
(f
CPU
=HSE)
f
CPU
= 125 kHz
0.06 0.08 0.09 0.10 0.12
f
CPU
= 1 MHz
0.10 0.17 0.18 0.19 0.22
f
CPU
= 4 MHz
0.24 0.36 0.39 0.41 0.44
f
CPU
= 8 MHz
0.50 0.58 0.61 0.62 0.64
f
CPU
= 16 MHz
1.00 1.08 1.14 1.16 1.18
LSI
f
CPU
= f
LSI
0.055 0.058 0.065 0.073 0.080
LSE
(8)
external
clock
(32.768 kHz)
f
CPU
= f
LSE
0.051 0.056 0.060 0.065 0.073
1. All peripherals OFF, V
DD
from 1.65 V to 3.6 V, HSI internal RC osc. , f
CPU
= f
SYSCLK
2. For temperature range 6.
3. For temperature range 7.
4. For temperature range 3.
5. Flash is configured in I
DDQ
mode in Wait mode by setting the EPM or WAITM bit in the Flash_CR1 register.
6. Oscillator bypassed (HSEBYP = 1 in CLK_ECKCR). When configured for external crystal, the HSE consumption
(I
DD HSE
) must be added. Refer to Ta b l e 31.
7. Tested in production.
8. Oscillator bypassed (LSEBYP = 1 in CLK_ECKCR). When configured for extenal crystal, the LSE consumption
(I
DD HSE
) must be added. Refer to Ta b l e 32.
Table 21. Total current consumption in Wait mode
Symbol Parameter
Conditions
(1)
Typ
Max
Unit
55°C
85
°C
(2)
105 °C
(3)
125 °C
(4)