Datasheet

Package characteristics STM8L151xx, STM8L152xx
124/131 DocID15962 Rev 13
10.2.6 28-pin wafer level chip size package (WLCSP28)
Figure 53. WLCSP28 package outline
1. Drawing is not to scale.
Bump side
Die ID
Notch
Side view
Detail A
Wafer back side
A1 ball
location
Bump
eee Z
A1
Detail A
rotated by 90 °C
aaa
D
ME_A0AM
Seating plane
A2
A
X
Y
(4X)
Z
Zbbb
b(28x)
E
e1
e
e
e2
G
F
A2
A
Front view