Datasheet

Package characteristics STM8L151xx, STM8L152xx
120/131 DocID15962 Rev 13
10.2.4 32-lead ultra thin fine pitch quad flat no-lead 5x5 mm package
(UFQFPN32)
Figure 49. UFQFPN32 package outline
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and
solder this back-side pad to PCB ground.
4. Dimensions are in millimeters.
Seating plane
ddd C
C
A3
A1
A
D
e
9
16
17
24
32
Pin # 1 ID
R = 0.30
8
E
L
L
D2
1
b
E2
A0B8_ME
Bottom view