Datasheet

STM8L151x2, STM8L151x3 Package characteristics
Doc ID 018780 Rev 4 103/112
10.2.2 32-lead ultra thin fine pitch quad flat no-lead 5x5 mm package
(UFQFPN32)
Figure 43. UFQFPN32 package outline
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and
solder this back-side pad to PCB ground.
4. Dimensions are in millimeters.
Seating plane
ddd C
C
A3
A1
A
D
e
9
16
17
24
32
Pin # 1 ID
R = 0.30
8
E
L
L
D2
1
b
E2
A0B8_ME
Bottom view